Patents by Inventor Christian Stoemmer

Christian Stoemmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11843191
    Abstract: A soldering aid for electrically conductively connecting a cable core of a cable to a conductor area includes a body made of an electrically insulating material and an electrically conductive contact part received in the body. The contact part has a contact surface configured to electrically conductively contact the conductor area. The body is formed with a receptacle having a slot open toward one side configured to receive the cable core of the cable, and is formed with a through-bore configured to surround a sheathed portion of the cable. The contact part closes an opening at a bottom of the slot and conductively contacts the cable core.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: December 12, 2023
    Assignee: MD ELEKTRONIK GMBH
    Inventors: Daniel Bock, Christian Stoemmer, Nikolaus Lechleitner
  • Patent number: 11729916
    Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 15, 2023
    Assignee: MD ELEKTRONIK GMBH
    Inventors: Gerd Mittermaier, Matthias Borkowski, Nikolaus Lechleitner, Johann Friesinger, Alexander Haas, Christian Stoemmer, Martin Sterkel, Lutz Rissing
  • Publication number: 20230124895
    Abstract: A plug connector, which can be fastened to a line, for transmitting optical and electrical signals, includes a contact support, two contact fastening regions, a lens fastening region and a locking member. The contact fastening regions are formed in the contact support and are each configured to receive an electrical contact, which is connectable to the line, for transmitting the electrical signals. The lens fastening region is formed in the contact support and is configured to receive, in an aligned manner, a lens member, which is connectable to the line, for transmitting the optical signals. The locking member is lockable to the contact support, and the line is fastenable to the plug connector using the locking member in a locked state.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 20, 2023
    Inventors: Roland Preis, Marijela Bajic, Markus Kaaserer, Christian Stoemmer
  • Publication number: 20220029321
    Abstract: A soldering aid for electrically conductively connecting a cable core of a cable to a conductor area includes a body made of an electrically insulating material and an electrically conductive contact part received in the body. The contact part has a contact surface configured to electrically conductively contact the conductor area. The body is formed with a receptacle having a slot open toward one side configured to receive the cable core of the cable, and is formed with a through-bore configured to surround a sheathed portion of the cable. The contact part closes an opening at a bottom of the slot and conductively contacts the cable core.
    Type: Application
    Filed: July 1, 2021
    Publication date: January 27, 2022
    Inventors: Daniel Bock, Christian Stoemmer, Nikolaus Lechleitner
  • Publication number: 20220030722
    Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 27, 2022
    Inventors: Gerd Mittermaier, Matthias Borkowski, Nikolaus Lechleitner, Johann Friesinger, Alexander Haas, Christian Stoemmer, Martin Sterkel, Lutz Rissing
  • Publication number: 20120285522
    Abstract: Method of depositing a TCO layer on a substrate, of depositing precursors of a solar cell and precursors of a solar cell are described. The methods includes DC sputtering a ZnO-containing transparent conductive oxide layer over the substrate, the substrate having a size of 1.4 m2 or above and texturing the ZnO-containing transparent conductive oxide layer, wherein the textured ZnO-containing transparent conductive oxide layer has a root means square roughness of 60 nm or below.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 15, 2012
    Applicant: Applied Materials, Inc.
    Inventors: Elisabeth Sommer, Philipp Obermeyer, Thomas Zilbauer, Inge Vermeir, Daniel Severin, Niels Kuhr, Markus Kress, Christof Kurthen, Ursula Ingeborg Schmidt, Stefan Klein, Susanne Buschbaum, Konrad Schwanitz, Christian Stoemmer, Tobias Stolley, Martin Rohde, Andreas Rembeck
  • Publication number: 20120080081
    Abstract: A method of manufacturing a layer stack adapted for a thin-film solar cell is and a precursor for a solar cell are described. The method includes depositing a TCO layer over a transparent substrate, depositing a first conductive-type layer a first p-i-n junction configured for the solar cell, depositing a first intrinsic-type layer of a first p-i-n junction configured for the solar cell and depositing a further conductive-layer with a conductivity opposite to the first conductive-type layer first p-i-n junction configured for the solar cell. The method further includes providing for a SiOx-containing intermediate layer by chemical vapor deposition and depositing a second p-i-n junction configured for the solar cell, wherein the SiOx-containing intermediate layer is provided within the a further conductive-type layer, and wherein the SiOx-containing layer has a thickness of 17 nm or less.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 5, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Stefan KLEIN, Tobias STOLLEY, Susanne Buschbaum, Martin Rohde, Konrad Schwanitz, Christian Stoemmer