Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: A heat transfer device including a container in which a heat-transfer fluid circulates in a closed loop. The heat transfer fluid is capable of undergoing an increase in volume on solidifying. The container further contains particles suspended in the heat-transfer fluid. At least some of the particles are compressible under the pressure of the fluid, as the fluid is solidifying, so as to at least partially compensate for the increase in volume of the fluid upon solidifying.

Abstract: A system for regulating the temperature of printed circuit boards comprises a first assembly of at least one Peltier element, for regulating the temperature of a second assembly of at least one electronic component or for harvesting thermal energy dissipated by the second assembly. At least one Peltier element of the first assembly is coupled to first heat-exchanging means that are coupled to at least one electronic component of the second assembly, and to second heat-exchanging means allowing thermal energy given off from at least one Peltier element of the first assembly to be dissipated.

Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: Heat-transfer device operating in a closed loop, comprising a container in which a heat-transfer fluid circulates in a closed loop, said heat-transfer fluid being capable of undergoing an increase in volume on solidifying, said container furthermore containing particles suspended in said heat-transfer fluid, in which at least some of the particles are compressible under the pressure of said fluid, as said fluid is solidifying, so as to at least partially compensate for the increase in volume of said fluid upon solidifying.

Abstract: A heat sink comprising a body made of a metallic material with good thermal and electricity conduction properties having a surface intended to support an electronic power component forming a heat source. The body comprises a plurality of openings axially crossed by tubes of circulation of a cooling liquid. Each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.