Abstract: The present disclosure relates to a memory hierarchy for a system-in-package. An example memory hierarchy is connectable to a processor via a memory management unit arranged for translating a virtual address sent by the processor into a physical address. The memory hierarchy has a data cache memory and a memory structure having at least a L1 memory array comprising at least one cluster. The memory structure comprises a first data access controller arranged for managing one or more banks of scratchpad memory of at least one of the clusters of at least the L1 memory array, comprising a data port for receiving at least one physical address and arranged for checking at run-time, for each received physical address, bits of the physical address to see if the physical address is present in the one or more banks of the at least one cluster of at least the L1 memory array.

Abstract: The present disclosure relates to low-layer memory for a computing platform. An example embodiment includes a memory hierarchy being directly connectable to a processor. The memory hierarchy includes at least a level 1, referred to as L1, memory structure comprising a non-volatile memory unit as L1 data memory and a buffer structure (L1-VWB). The buffer structure includes a plurality of interconnected wide registers with an asymmetric organization, wider towards the non-volatile memory unit than towards a data path connectable to the processor. The buffer structure and the non-volatile memory unit are arranged for being directly connectable to a processor so that data words can be read directly from either of the L1 data memory and the buffer structure (L1-VWB) by the processor.

Abstract: The present disclosure relates to a memory hierarchy for a system-in-package. An example memory hierarchy is connectable to a processor via a memory management unit arranged for translating a virtual address sent by the processor into a physical address. The memory hierarchy has a data cache memory and a memory structure having at least a L1 memory array comprising at least one cluster. The memory structure comprises a first data access controller arranged for managing one or more banks of scratchpad memory of at least one of the clusters of at least the L1 memory array, comprising a data port for receiving at least one physical address and arranged for checking at run-time, for each received physical address, bits of the physical address to see if the physical address is present in the one or more banks of the at least one cluster of at least the L1 memory array.

Abstract: The present disclosure relates to low-layer memory for a computing platform. An example embodiment includes a memory hierarchy being directly connectable to a processor. The memory hierarchy includes at least a level 1, referred to as L1, memory structure comprising a non-volatile memory unit as L1 data memory and a buffer structure (L1-VWB). The buffer structure includes a plurality of interconnected wide registers with an asymmetric organization, wider towards the non-volatile memory unit than towards a data path connectable to the processor. The buffer structure and the non-volatile memory unit are arranged for being directly connectable to a processor so that data words can be read directly from either of the L1 data memory and the buffer structure (L1-VWB) by the processor.