Abstract: A heat sink absorbs heat from a chip or other component (32) and transfers the heat to a cooling fluid (36). The sink has a shaped part (22?) on which are formed at least one element (56?) for supplying cooling fluid (36) and at least one element (62?) for removing cooling fluid (36). The heat sink has a heat absorber (68?) with a heat-absorption side (112u) that absorbs heat during operation and a heat-transfer side (78) in contact with the cooling fluid (36) during operation. The absorber has a depression (118) in which are arranged a plurality of elongated thermally conductive elements (84?) which are each connected at a first end to the depression (118), and each have a free end (78) projecting away from the depression (118). Optionally, the heat sink can be coupled to a radiating or cooling unit (38), a fluid-circulating pump (39) and a fan (40) for directing air over the cooling unit, in order to quickly dissipate the heat transferred to the cooling fluid (36).