Patents by Inventor Christian Tronche

Christian Tronche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8581663
    Abstract: A system for multi-distributed amplification of a communication signal including at least one plurality N of input pathways connected to an input Butler matrix which delivers as output N distributed signals, a plurality N of tube amplifiers which receive as input said distributed signals and produce as output N amplified and phase-shifted signals each of a complex gain Gi and an output Butler matrix which receives as input said amplified signals and produces as output N output signals, wherein the phase error and amplitude error are self-compensated in the presence of traffic.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: November 12, 2013
    Assignee: Thales
    Inventors: Christian Tronche, Jean-Marc Soulie
  • Publication number: 20120280748
    Abstract: A system for multi-distributed amplification of a communication signal including at least one plurality N of input pathways connected to an input Butler matrix which delivers as output N distributed signals, a plurality N of tube amplifiers which receive as input said distributed signals and produce as output N amplified and phase-shifted signals each of a complex gain Gi and an output Butler matrix which receives as input said amplified signals and produces as output N output signals, wherein the phase error and amplitude error are self-compensated in the presence of traffic.
    Type: Application
    Filed: October 20, 2010
    Publication date: November 8, 2012
    Applicant: THALES
    Inventors: Christian Tronche, Jean-Marc Soulie
  • Patent number: 5917388
    Abstract: The invention provides a microwave module including a plurality of stacked elementary structures forming a unit, each elementary structure comprising a bottom dielectric layer on a top surface of which an integrated circuit (20, 21) is disposed, and a top dielectric layer covering the circuit (20, 21). The module is characterized by a connection line (20a, 30, 21a) between two respective circuits belonging to first and second elementary structures, the connection line being constituted by an input coplanar line (21a) disposed on the top surface of the bottom dielectric layer of the first structure, by an output coplanar line (20a) disposed on the top surface of the bottom dielectric layer of the second structure, and a by link coplanar line (30) connecting one end of the input coplanar line to one end of the output coplanar line.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: June 29, 1999
    Assignee: Alcatel Espace
    Inventors: Christian Tronche, Philippe Monfraix, Augustin Coello Vera