Abstract: The present disclosure relates to a headset which is configured to receive a detachable arm, wherein the detachable arm comprises an arm input transducer. The headset may be configured to be operated in different modes depending on the arm being attached or not. The headset may be configured to detect if the arm is attached or not. A set of magnets may be used to keep the arm attached to the earcup while allowing a user to detach the arm from the earcup.

Abstract: The invention relates to an ear cup with an attachment unit, which is configured to be used within a head-worn hearing device. The attachment unit comprises at least one connection section, which is arranged and configured to rotatable connect the attachment unit with the ear cup and thereby define an axis of rotation of the ear cup. The attachment unit further comprises an opening, which is arranged to allow a charge interface of the ear cup, which extends out of an ear cup casing of the ear cup, to pivot through the attachment unit while the ear cup is being rotated with respect to the attachment unit along the axis of rotation, wherein the charge interface is directed to the attachment unit and is placed at a side portion of the ear cup between a hearing portion of the ear cup, facing to an ear of a user, and a back portion of the ear cup, facing away from the user.

Abstract: The invention relates to an ear cup with an attachment unit, which is configured to be used within a head-worn hearing device. The attachment unit comprises at least one connection section, which is arranged and configured to rotatable connect the attachment unit with the ear cup and thereby define an axis of rotation of the ear cup. The attachment unit further comprises an opening, which is arranged to allow a charge interface of the ear cup, which extends out of an ear cup casing of the ear cup, to pivot through the attachment unit while the ear cup is being rotated with respect to the attachment unit along the axis of rotation, wherein the charge interface is directed to the attachment unit and is placed at a side portion of the ear cup between a hearing portion of the ear cup, facing to an ear of a user, and a back portion of the ear cup, facing away from the user.

Abstract: A locking device for securing a piece of electronic equipment to a structure is disclosed. The locking device comprises one or more mounting structures configured to fix the locking device to the structure. The locking device comprises one or more cable guides configured to receive a cable of the piece of electronic equipment and hereby restrict the range of motion of the piece of electronic equipment. The locking device includes one or more features to prevent the locking device from being unlocked.

Abstract: A microphone boom is provided with an extendable microphone assembly, and a headset having such a microphone boom. The headset includes a casing accommodating the signal transmission circuitry and further includes a speaker adapted to serve a sound signal at the proximity of a user's ear and the speaker is protruding from the casing at a speaker-end of the casing and a microphone assembly is fixated relative to the casing distally with respect to the speaker-end.

Abstract: A microphone boom is provided with an extendable microphone assembly, and a headset having such a microphone boom. The headset includes a casing accommodating the signal transmission circuitry and further includes a speaker adapted to serve a sound signal at the proximity of a user's ear and the speaker is protruding from the casing at a speaker-end of the casing and a microphone assembly is fixated relative to the casing distally with respect to the speaker-end.

Abstract: A microphone boom is provided with extendable microphone arrays, and a headset having such a microphone boom. The headset comprise a casing accommodating the signal transmission circuitry and further comprises a speaker adapted to serve a sound signal at the proximity of a users ear and the speaker is protruding from the casing at a speaker-end of the casing and one microphone array is fixated relative to the casing distally with respect to the speaker-end.

Abstract: A microphone boom is provided with extendable microphone arrays, and a headset having such a microphone boom. The headset comprise a casing accommodating the signal transmission circuitry and further comprises a speaker adapted to serve a sound signal at the proximity of a users ear and the speaker is protruding from the casing at a speaker-end of the casing and one microphone array is fixated relative to the casing distally with respect to the speaker-end.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Abstract: A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/° C.

Abstract: A headset with side support is provided, where a speaker module is coupled to a side support by means of an elongate resilient spring such that the speaker module and the side support are placeable at each their side of a users head and where the spring provides a holding force which presses the speaker module and the side support in a direction towards each other wherein the spring comprises a metal core and this core comprises a re-enforcement at the side support which extends transversely to the length direction of the elongate spring.

Abstract: A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/° C.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.