Abstract: A packaging method is described in which at least one primary packaging (2) is inserted through a closable opening into a secondary packaging (3) after a handling device (20) has been positioned at the closable opening of the secondary packaging (3). The primary packaging (2) is guided by the handling device (20) during its insertion into the opening of the secondary packaging (3), and a target position of the primary packaging (2) is predetermined within the secondary packaging (3). After insertion of the at least one primary packaging (2) into the secondary packaging (3), the opening of the secondary packaging (3) is at least partially closed under the cooperation or action of the handling device (20). Furthermore, a packaging module is described which is designed to perform such a packaging process.

Abstract: A semiconductor wafer having a main surface and a rear surface opposite from the main surface is provided. A die singulation preparation step is performed in kerf regions of the semiconductor wafer. The kerf regions enclose a plurality of die sites. The die singulation preparation step includes forming one or more preliminary kerf trenches between at least two immediately adjacent die sites. The method further includes forming active semiconductor devices in the die sites, and singulating the semiconductor wafer in the kerf regions thereby providing a plurality of discrete semiconductor dies from the die sites. The one or more preliminary kerf trenches are unfilled during the singulating, and the singulating includes removing semiconductor material from a surface of the semiconductor wafer that is between opposite facing sidewalls of the one or more preliminary kerf trenches.

Abstract: A semiconductor wafer having a main surface and a rear surface opposite from the main surface is provided. A die singulation preparation step is performed in kerf regions of the semiconductor wafer. The kerf regions enclose a plurality of die sites. The die singulation preparation step includes forming one or more preliminary kerf trenches between at least two immediately adjacent die sites. The method further includes forming active semiconductor devices in the die sites, and singulating the semiconductor wafer in the kerf regions thereby providing a plurality of discrete semiconductor dies from the die sites. The one or more preliminary kerf trenches are unfilled during the singulating, and the singulating includes removing semiconductor material from a surface of the semiconductor wafer that is between opposite facing sidewalls of the one or more preliminary kerf trenches.

Abstract: The present invention includes an apparatus (1) and a method for handling articles and comprises an upper suspension (3) with at least three rotatably driven positioning arms (5), where the positioning arms (5) each comprise at least two arm sections (7, 9) that are swivelable relative to each other and operated independently of one another. A manipulator (32) comprises one or more clamping jaws (34, 36) and is mechanically coupled to the positioning arms (5) such the manipulator can be positioned by movement of one or more of the positioning arms (5). At least one drive shaft (12) is linked non-rotatingly to the manipulator, such that the manipulator is rotated by movement of the at least one drive shaft (12). Rotation of the at least one drive shaft (12) also controls the one or more clamping jaws (34, 36) via the at least one actuating shaft (14).

Abstract: The present invention includes an apparatus (1) and a method for handling articles and comprises an upper suspension (3) with at least three rotatably driven positioning arms (5), where the positioning arms (5) each comprise at least two arm sections (7, 9) that are swivelable relative to each other and operated independently of one another. A manipulator (32) comprises one or more clamping jaws (34, 36) and is mechanically coupled to the positioning arms (5) such the manipulator can be positioned by movement of one or more of the positioning arms (5). At least one drive shaft (12) is linked non-rotatingly to the manipulator, such that the manipulator is rotated by movement of the at least one drive shaft (12). Rotation of the at least one drive shaft (12) also controls the one or more clamping jaws (34, 36) via the at least one actuating shaft (14).

Abstract: The present invention includes a method for the handling of articles such as packs, piece goods or the like. The method is performed with a device comprising an upper suspension, to which at least three rotatable driven actuating arms are attached. The device comprises a manipulator with one or more sets of clamping jaws for gripping the articles and which is mechanically coupled to the at least three actuating arms. A position of the manipulator can be defined by a movement of one or more of the at least three actuating arms via a linear guide. The linear guide is formed as a rotatable first shaft and connected to the manipulator in a torque proof manner. The manipulator is rotated together with the first shaft by a rotational movement of the first shaft. At least one actuating device designed as a second shaft passes through the linear guide and controls the one or more sets of clamping jaws for temporarily gripping and releasing of articles.