Patents by Inventor Christian Wilhelmus Baks

Christian Wilhelmus Baks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923269
    Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: March 5, 2024
    Assignee: International Business Machines Corporation
    Inventors: Mark D. Schultz, Fuad Elias Doany, Benjamin Giles Lee, Daniel M. Kuchta, Christian Wilhelmus Baks
  • Patent number: 11764468
    Abstract: A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: September 19, 2023
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, FUJIKURA LTD
    Inventors: Alberto Valdes Garcia, Arun Paidimarri, Bodhisatwa Sadhu, Jean-Olivier Plouchart, Xiaoxiong Gu, Christian Wilhelmus Baks, Yo Yamaguchi, Kiyoshi Kobayashi, Yoshiharu Fujisaku, Ning Guan
  • Publication number: 20230074376
    Abstract: A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 9, 2023
    Inventors: Alberto Valdes Garcia, Arun Paidimarri, Bodhisatwa Sadhu, Jean-Olivier Plouchart, Xiaoxiong Gu, Christian Wilhelmus Baks, Yo Yamaguchi, Kiyoshi Kobayashi, Yoshiharu Fujisaku, Ning Guan
  • Publication number: 20220328375
    Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 13, 2022
    Inventors: Mark D. Schultz, Fuad Elias Doany, Benjamin Giles Lee, Daniel M. Kuchta, Christian Wilhelmus Baks
  • Patent number: 10826194
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: November 3, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 10784563
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 22, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Publication number: 20190260109
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Publication number: 20190260138
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 9985346
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: May 29, 2018
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Publication number: 20170125895
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Patent number: 9620464
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: April 11, 2017
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Publication number: 20160049723
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Application
    Filed: March 20, 2015
    Publication date: February 18, 2016
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Patent number: 9076615
    Abstract: A method is provided to form an electromechanical relay. A magnetic layer is etched to form a substrate-metal structure having a pattern of conductive contacts. The substrate-metal structure is electroplated. The electroplated structure is attached to a printed circuit board (PCB). A portion of the electroplated structure is removed to electrically decouple the conductive contacts. The PCB includes a common contact terminal aligned to one end of each conductive contact. The PCB includes magnetic actuators each having a magnetic core with a first core part disposed within a via extending through layers of the PCB, and an electrical coil disposed around the first core part within layers of the PCB. Each conductive contact is aligned to an associated magnetic actuator to enable electrical contact between the common contact terminal and the conductive contact upon activation of the associated magnetic actuator.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: July 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Publication number: 20130247362
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: May 21, 2013
    Publication date: September 26, 2013
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Patent number: 8436701
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: May 7, 2013
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Publication number: 20120188033
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: March 21, 2012
    Publication date: July 26, 2012
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Publication number: 20110193661
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 11, 2011
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Patent number: 7539366
    Abstract: An optical module. The optical module includes a printed circuit board and an opto-chip. The opto-chip includes a transparent carrier with an optoelectronic device array and an associated integrated circuit array that are flip chip attached to the transparent carrier. The optoelectronic device array and the associated integrated circuit array are interconnected via surface wiring with bond sites. In addition, the associated integrated circuit array extends beyond the transparent carrier to provide direct flip chip attachment of the opto-chip to the printed circuit board.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: May 26, 2009
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Fuad Elias Doany, Clint Lee Schow