Patents by Inventor Christian Witt

Christian Witt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12199177
    Abstract: Structures for a high-electron-mobility transistor and methods of forming such structures. The structure comprises a device structure including a gate and an ohmic contact, and one or more inactive blocks laterally positioned between the gate and the ohmic contact.
    Type: Grant
    Filed: July 11, 2024
    Date of Patent: January 14, 2025
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Abhinay Sandupatla, Bartłomiej Jan Pawlak, Christian Witt
  • Patent number: 10916139
    Abstract: A system and method to capture and aggregate occupant and incident information from within a vehicle following an accident, and to transmit such aggregated incident and patient data, in an automated and event triggered fashion, to an emergency responder. The data transmitted to the emergency responder can trigger creating a new patient record for the occupant of the vehicle.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: February 9, 2021
    Inventors: Jonathon S. Feit, Christian Witt
  • Patent number: 10886215
    Abstract: Example embodiments relate to interconnect structures and related methods. One embodiment includes an interconnect structure. The interconnect structure includes a first interconnection level including a first dielectric layer and a first set of conductive paths. The interconnect structure also includes a second interconnection level arranged above the first interconnection level and including a second dielectric layer and a second set of conductive paths. Further, the interconnect structure includes a third interconnection level arranged above the second interconnection level and including a third dielectric layer and a third set of conductive paths. In addition, the interconnect structure includes a fourth interconnection level arranged above the third interconnection level and including a fourth dielectric layer and a fourth set of conductive paths. Still further, the interconnect structure includes a first multi-level via structure and a second multi-level via structure.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: January 5, 2021
    Assignee: IMEC VZW
    Inventors: Houman Zahedmanesh, Victoria L. Calero Diaz Del Castillo, Christian Witt
  • Patent number: 10860298
    Abstract: A computer-implemented method for editing one or more properties of one or more model elements in a block diagram of a technical computing environment. The model elements include blocks and variables in blocks, wherein one or more properties are assigned to each model element. The technical computing environment has a model editor, a data definition tool and a code generator. A processor of a host computer opens a block diagram in the model editor, displays a list of model elements present in the block diagram, receives a selection of one or more model elements, highlights the selected model elements, receives an edit command to set a new value for a chosen property of the selected model elements, and sets the chosen property to the new value. A non-transitory computer readable medium and a computer system is also provided.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: December 8, 2020
    Assignee: dSPACE digital signal processing and control engineering GmbH
    Inventors: Torsten Pietzsch, Wolfgang Trautmann, Christian Witte
  • Publication number: 20200105667
    Abstract: Example embodiments relate to interconnect structures and related methods. One embodiment includes an interconnect structure. The interconnect structure includes a first interconnection level including a first dielectric layer and a first set of conductive paths. The interconnect structure also includes a second interconnection level arranged above the first interconnection level and including a second dielectric layer and a second set of conductive paths. Further, the interconnect structure includes a third interconnection level arranged above the second interconnection level and including a third dielectric layer and a third set of conductive paths. In addition, the interconnect structure includes a fourth interconnection level arranged above the third interconnection level and including a fourth dielectric layer and a fourth set of conductive paths. Still further, the interconnect structure includes a first multi-level via structure and a second multi-level via structure.
    Type: Application
    Filed: July 24, 2019
    Publication date: April 2, 2020
    Inventors: Houman Zahedmanesh, Victoria L. Calero Diaz Del Castillo, Christian Witt
  • Patent number: 10580696
    Abstract: Structures for interconnects and methods of forming interconnects. An interconnect opening in a dielectric layer includes a first portion and a second portion arranged over the first portion. A first conductor layer composed of a first metal is arranged inside the first portion of the interconnect opening. A second conductor layer composed of a second metal is arranged inside the second portion of the interconnect opening. The first metal is ruthenium.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: March 3, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sean Xuan Lin, Christian Witt, Mark V. Raymond, Nicholas V. LiCausi, Errol Todd Ryan
  • Publication number: 20200066585
    Abstract: Structures for interconnects and methods of forming interconnects. An interconnect opening in a dielectric layer includes a first portion and a second portion arranged over the first portion. A first conductor layer composed of a first metal is arranged inside the first portion of the interconnect opening. A second conductor layer composed of a second metal is arranged inside the second portion of the interconnect opening. The first metal is ruthenium.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Inventors: Sean Xuan Lin, Christian Witt, Mark V. Raymond, Nicholas V. LiCausi, Errol Todd Ryan
  • Patent number: 10512598
    Abstract: The present disclosure relates to a liquid agent and/or hair dye for oxidative coloring of keratinous fibers with improved color performance and nourishing effect. In an embodiment, the agent comprises, in a hydrous cosmetic carrier: (a) a fatty acid which is liquid at 20° C. and has about 16-22 carbon atoms in an amount of about 0.1-15 wt. %, (b) an alkanolamine as an alkalizing agent, selected from monoethanolamine, 2-amino-2-methylpropanol and triethanolamine, in an amount such that at least one part of the fatty acid is present as soap, (c) an oil component different from (a) in an amount of about 0.05-5 wt. %, (d) an alkylamidoamine in an amount of about 0.05-6 wt. %, and (e) an oxidation dye precursor. The agent does not contain any branched fatty alcohols having about 7 or more carbon atoms, and does not contain any fatty alcohols having a melting point of about 25° C. or higher.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: December 24, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christiane Witte, Stephan Schwartz
  • Publication number: 20190060194
    Abstract: The present disclosure relates to a liquid agent and/or hair dye for oxidative coloring of keratinous fibers with improved color performance and nourishing effect. In an embodiment, the agent comprises, in a hydrous cosmetic carrier: (a) a fatty acid which is liquid at 20° C. and has about 16-22 carbon atoms in an amount of about 0.1-15 wt. %, (b) an alkanolamine as an alkalizing agent, selected from monoethanolamide, 2-amino-2-methylpropanol and triethanolamine, in an amount such that at least one part of the fatty acid is present as soap, (c) an oil component different from (a) in an amount of about 0.05-5 wt. %, (d) an alkylamidoamine in an amount of about 0.05-6 wt. %, and (e) an oxidation dye precursor. The agent does not contain any branched fatty alcohols having about 7 or more carbon atoms, and does not contain any fatty alcohols having a melting point of about 25° C. or higher.
    Type: Application
    Filed: September 26, 2016
    Publication date: February 28, 2019
    Applicant: Henkel AG & Co. KGaA
    Inventors: Christiane Witte, Stephan Schwartz
  • Patent number: 10143634
    Abstract: A composition for oxidative hair treatment, containing 50-96% by weight; 0.5-20% by weight hydrogen peroxide; at least one polyethylene glycol ether of a monoester of glycerol and a C12-C22 carboxylic acid having 110-500 ethylene oxide units in the molecule, according to formula (I), wherein the sum of the indices x+y+z stands for a number in the range of 110 to 500, and R stands for an alkyl functional group having 11 to 21 carbon atoms, which may be saturated or unsaturated, linear or branched, wherein all stated quantities are based on the weight of the oxidation composition. Wherein the composition is suited for use as a developer for oxidative hair lighteners and/or hair dyes. The alkaline composition (A) is present as an oil-in-water emulsion and includes at least one alkalizing agent, and has a pH in the range of 8 to 11.5.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: December 4, 2018
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christiane Witte, Stephan Schwartz
  • Publication number: 20170273879
    Abstract: A composition for oxidative hair treatment, containing 50-96% by weight; 0.5-20% by weight hydrogen peroxide; at least one polyethylene glycol ether of a monoester of glycerol and a C12-C22 carboxylic acid having 110-500 ethylene oxide units in the molecule, according to formula (I), wherein the sum of the indices x+y+z stands for a number in the range of 110 to 500, and R stands for an alkyl functional group having 11 to 21 carbon atoms, which may be saturated or unsaturated, linear or branched, wherein all stated quantities are based on the weight of the oxidation composition. Wherein the composition is suited for use as a developer for oxidative hair lighteners and/or hair dyes. The alkaline composition (A) is present as an oil-in-water emulsion and includes at least one alkalizing agent, and has a pH in the range of 8 to 11.5.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Applicant: Henkel AG & Co. KGaA
    Inventors: Christiane Witte, Stephan Schwartz
  • Publication number: 20170270252
    Abstract: A system and method to capture and aggregate occupant and incident information from within a vehicle following an accident, and to transmit such aggregated incident and patient data, in an automated and event triggered fashion, to an emergency responder. The data transmitted to the emergency responder can trigger creating a new patient record for the occupant of the vehicle.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 21, 2017
    Inventors: Jonathon S. Feit, Christian Witt
  • Patent number: 9768058
    Abstract: One illustrative method disclosed herein includes, among other things, forming a plurality of trenches in a layer of insulating material, performing at least one damage-causing process operation to selectively damage portions of the insulating material adjacent the trenches, forming a conductive line in each of the trenches, after forming the conductive lines, performing a selective etching process to selectively remove at least portions of the damaged portions of the insulating material and thereby define an air gap positioned laterally adjacent each of the conductive lines, and forming a capping layer of material above the conductive lines, the air gap and the undamaged portion of the layer of insulating material.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: September 19, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Zhiguo Sun, Qiang Fang, Christian Witt
  • Publication number: 20170047242
    Abstract: One illustrative method disclosed herein includes, among other things, forming a plurality of trenches in a layer of insulating material, performing at least one damage-causing process operation to selectively damage portions of the insulating material adjacent the trenches, forming a conductive line in each of the trenches, after forming the conductive lines, performing a selective etching process to selectively remove at least portions of the damaged portions of the insulating material and thereby define an air gap positioned laterally adjacent each of the conductive lines, and forming a capping layer of material above the conductive lines, the air gap and the undamaged portion of the layer of insulating material.
    Type: Application
    Filed: August 10, 2015
    Publication date: February 16, 2017
    Inventors: Zhiguo Sun, Qiang Fang, Christian Witt
  • Patent number: 9440531
    Abstract: A power-train is provided for a driven, steerable axle of a motor vehicle. To reduce the size of the turning radius of the vehicle, the power train includes a left drive shaft that is fixedly connected in terms of drive to a left steerable wheel; a right drive shaft that is fixedly connected in terms of drive to a right steerable wheel; and a drive unit configured between the drive shafts for driving the drive shaft; the drive shafts being configured as articulated shafts, each having a wheel-proximal articulated joint and a wheel-distal articulated joint; and said articulated joints each having at least one axis of rotation with the same orientation for all articulated joints. The drive unit is designed for transmitting an electromotively generated torque to the drive shafts, and having a body suspension that allows the drive unit to rotate relative to the body about a swivel axis that extends in parallel to the axes of rotation having the same orientation.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: September 13, 2016
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Raphael Fischer, Thorsten Schubert, Thomas Mehlis, Christian Witt
  • Publication number: 20160104670
    Abstract: A method includes forming a ballistic conductor line above a first metallization layer. A dielectric layer is formed above the ballistic conductor line. A first via is embedded in the dielectric layer contacting a first portion of the ballistic conductor line. A second via is embedded in the dielectric layer contacting a second portion of the ballistic conductor line to define a signal path between the first and second vias through the ballistic conductor line.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 14, 2016
    Inventors: Roderick A. Augur, Christian Witt
  • Publication number: 20160104672
    Abstract: A method of electrically connecting first and second conductive features includes forming a first metallization layer including the first conductive feature. A ballistic conductor line is formed above the first metallization layer. The ballistic conductor line contacts the first conductive feature proximate a first end of the ballistic conductor line. The second conductive feature is contacted proximate a second end of the ballistic conductor line.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 14, 2016
    Inventors: Roderick A. Augur, Christian Witt
  • Patent number: 9236299
    Abstract: One method includes forming a barrier layer in a trench/opening in an insulating material, forming a first region of a copper material above the barrier layer, forming a metal layer in the trench/opening on the first region of copper material, forming a second region of copper material on the metal layer, performing at least one CMP process to remove any materials positioned above a planarized upper surface of the layer of insulating material outside of the trench/opening so as to thereby define a structure comprised of the metal layer positioned between the first and second regions of copper material, forming a dielectric cap layer above the layer of insulating material and above the structure, and performing a metal diffusion anneal process to form a metal cap layer adjacent at least the upper surface of a conductive copper structure.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: January 12, 2016
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Xunyuan Zhang, Hoon Kim, Christian Witt, Larry Zhao
  • Publication number: 20150255339
    Abstract: One method includes forming a barrier layer in a trench/opening in an insulating material, forming a first region of a copper material above the barrier layer, forming a metal layer in the trench/opening on the first region of copper material, forming a second region of copper material on the metal layer, performing at least one CMP process to remove any materials positioned above a planarized upper surface of the layer of insulating material outside of the trench/opening so as to thereby define a structure comprised of the metal layer positioned between the first and second regions of copper material, forming a dielectric cap layer above the layer of insulating material and above the structure, and performing a metal diffusion anneal process to form a metal cap layer adjacent at least the upper surface of a conductive copper structure.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: GLOBALFOUNDRIES Inc.
    Inventors: Xunyuan Zhang, Hoon Kim, Christian Witt, Larry Zhao
  • Patent number: 9054052
    Abstract: A process is provided for methods of reducing damage to an ultra-low k layer during fabrication. In one aspect, a method includes: providing a cured ultra-low k film containing pores filled with a pore-stuffing material; and modifying an exposed surface of the ultra-low k film to provide a modified layer in the ultra-low k film. In another aspect, a semiconductor device comprising a modified layer on a surface of an ultra-low k film is provided.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: June 9, 2015
    Assignee: GLOBAL FOUNDRIES INC.
    Inventors: Nicholas Vincent Licausi, Errol Todd Ryan, Ming He, Moosung M. Chae, Kunaljeet Tanwar, Larry Zhao, Christian Witt, Ailian Zhao, Sean X. Lin, Xunyuan Zhang