Patents by Inventor Christian Wunderle

Christian Wunderle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component cooling
    Patent number: 10506741
    Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 10, 2019
    Assignee: TRUMPF Huettinger GmbH + Co. KG
    Inventors: Roland Lodholz, Christian Wunderle
  • ELECTRONIC COMPONENT COOLING
    Publication number: 20190021187
    Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.
    Type: Application
    Filed: August 24, 2018
    Publication date: January 17, 2019
    Inventors: Roland Lodholz, Christian Wunderle
  • Electronic component cooling
    Patent number: 10076057
    Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: September 11, 2018
    Assignee: TRUMPF Huettinger GmbH + Co. KG
    Inventors: Roland Lodholz, Christian Wunderle
  • Electronic Component Cooling
    Publication number: 20160105998
    Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.
    Type: Application
    Filed: December 15, 2015
    Publication date: April 14, 2016
    Inventors: Roland Lodholz, Christian Wunderle