Patents by Inventor Christian Zeilmann

Christian Zeilmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an LTCC substrate
    Patent number: 8250748
    Abstract: An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization (20) arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization (20) preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer (22) covering the first metallization (20), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer (24) arranged on the diffusion barrier layer (22) are provided, wherein the second metal layer (24) preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: August 28, 2012
    Assignee: Biotronik CRM Patent AG
    Inventors: Dieter Schwanke, Christian Zeilmann, Michael Krenkel
  • LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20100059255
    Abstract: An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization (20) arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization (20) preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer (22) covering the first metallization (20), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer (24) arranged on the diffusion barrier layer (22) are provided, wherein the second metal layer (24) preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.
    Type: Application
    Filed: August 26, 2009
    Publication date: March 11, 2010
    Inventors: Dieter SCHWANKE, Christian ZEILMANN, Michael KRENKEL