Abstract: A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

Abstract: A cable holder (10) attaches to a cable (1) with a plurality of cores (2). The cable holder (10) has a receiving body (11) with a plurality of receiving chambers (12). The chambers (12) extend in a cable longitudinal direction (L). An insertion opening (13) is formed at least on one side of the receiving chamber for inserting an end of a core (2). A fastening portion (14) is connected to the receiving chamber (12). The fastening portion (14) fastens the cable holder (10) to the outer sheath of the cable (1) by a fastening device (3) engaging around the cable (1).

Abstract: A cable holder (10) attaches to a cable (1) with a plurality of cores (2). The cable holder (10) has a receiving body (11) with a plurality of receiving chambers (12). The chambers (12) extend in a cable longitudinal direction (L). An insertion opening (13) is formed at least on one side of the receiving chamber for inserting an end of a core (2). A fastening portion (14) is connected to the receiving chamber (12). The fastening portion (14) fastens the cable holder (10) to the outer sheath of the cable (1) by a fastening device (3) engaging around the cable (1).

Abstract: The invention relates to a power semiconductor device with a substrate with a cooling device and power semiconductor components connected thereon, having load current terminal elements and a cooling device. Pressure devices have a pressure element is arranged movably in a direction normal (N) to the substrate, and an elastic deformation element between the pressure element and a load current terminal element. The pressure element presses the assigned load current terminal element against an electrically conductive contact area of the substrate via the elastic deformation element and provides electrically conductive pressure contacting of the assigned load current terminal element with the substrate. The electrical connection of the power semiconductor device is improved.

Abstract: The invention relates to a power semiconductor device with a substrate with a cooling device and power semiconductor components connected thereon, having load current terminal elements and a cooling device. Pressure devices have a pressure element is arranged movably in a direction normal (N) to the substrate, and an elastic deformation element between the pressure element and a load current terminal element. The pressure element presses the assigned load current terminal element against an electrically conductive contact area of the substrate via the elastic deformation element and provides electrically conductive pressure contacting of the assigned load current terminal element with the substrate. The electrical connection of the power semiconductor device is improved.