Abstract: Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10 ?/?, or even less than 1 ?/?.

Abstract: Dielectric coating compositions are provided. The dielectric coating compositions generally include an aqueous binder, an inorganic nanoparticle, and a solvent, and can be formulated for specific printing methods, such as inkjet printing. The dielectric coating compositions are curable to provide scratch resistant coatings useful as insulating layers.

Abstract: Described herein are adhesive gold inks, and methods for making and depositing these inks to form conductive traces. The adhesive gold inks generally contain a gold complex dissolved in a mixed solvent system including at least a diol and an amine. The mixed solvent system may further include a thioalkyldiol. The gold complex includes a first ligand and a second ligand. The first ligand may be a thioether, a phosphine, or an amine that volatilizes upon heating at a temperature of 200° C. or less. The second ligand may be a halide or a carboxylate. The adhesive gold inks are clear and particle-free and may be formulated for deposition by a wide range of printing methods on both flexible and non-flexible substrates.

Abstract: Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10?/?, or even less than 1?/?.

Abstract: Described herein are adhesive gold inks, and methods for making and depositing these inks to form conductive traces. The adhesive gold inks generally contain a gold complex dissolved in a mixed solvent system including at least a diol and an amine. The mixed solvent system may further include a thioalkyldiol. The gold complex includes a first ligand and a second ligand. The first ligand may be a thioether, a phosphine, or an amine that volatilizes upon heating at a temperature of 200° C. or less. The second ligand may be a halide or a carboxylate. The adhesive gold inks are clear and particle-free and may be formulated for deposition by a wide range of printing methods on both flexible and non-flexible substrates.

Abstract: Dielectric coating compositions are provided. The dielectric coating compositions generally include an aqueous binder, an inorganic nanoparticle, and a solvent, and can be formulated for specific printing methods, such as inkjet printing. The dielectric coating compositions are curable to provide scratch resistant coatings useful as insulating layers.