Patents by Inventor Christianto Chih-Ching Liu

Christianto Chih-Ching Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices comprising GSG interconnect structures
    Patent number: 8937389
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In an embodiment, a method of manufacturing a semiconductor device includes forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width. The second width is different than the first width. The method includes forming a second conductive structure in a second metallization layer proximate the first metallization layer, and coupling a portion of the second conductive structure to the first portion of the first conductive structure.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: January 20, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Christianto Chih-Ching Liu, Shuo-Mao Chen, Der-Chyang Yeh, Shang-Yun Hou, Shin-Puu Jeng
  • Semiconductor Devices and Methods of Manufacture Thereof
    Publication number: 20140042612
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In an embodiment, a method of manufacturing a semiconductor device includes forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width. The second width is different than the first width. The method includes forming a second conductive structure in a second metallization layer proximate the first metallization layer, and coupling a portion of the second conductive structure to the first portion of the first conductive structure.
    Type: Application
    Filed: August 7, 2012
    Publication date: February 13, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Christianto Chih-Ching Liu, Shuo-Mao Chen, Der-Chyang Yeh, Shang-Yun Hou, Shin-Puu Jeng