Abstract: A vertical batch furnace assembly, comprising a core tube, an outer casing, a cooling chamber bounded and enclosed by the outer casing and the core tube, and at least one cooling gas supply emanating in the cooling chamber. The core tube has an elongated circumferential wall extending in a longitudinal direction, and is configured to accommodate wafers for processing in the vertical batch furnace. The outer casing extends around the core tube and comprises a heating element for applying a thermal treatment to wafers accommodated in the core tube. The at least one cooling gas supply comprises at least one cooling gas supply opening which is arranged such that the cooling gas enters the cooling chamber with a flow direction which is substantially tangent to the circumferential wall.

Abstract: A vertical batch furnace assembly, comprising a core tube, an outer casing, a cooling chamber bounded and enclosed by the outer casing and the core tube, and at least one cooling gas supply emanating in the cooling chamber. The core tube has an elongated circumferential wall extending in a longitudinal direction, and is configured to accommodate wafers for processing in the vertical batch furnace. The outer casing extends around the core tube and comprises a heating element for applying a thermal treatment to wafers accommodated in the core tube. The at least one cooling gas supply comprises at least one cooling gas supply opening which is arranged such that the cooling gas enters the cooling chamber with a flow direction which is substantially tangent to the circumferential wall.

Abstract: Wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, and comprising a rotatable table comprising a first and a second wafer boat support surface. Each wafer boat support surface is configured for supporting a wafer boat. The rotatable table is rotatable by an actuator to rotate both the first and the second wafer support surfaces to a load/receive position in which the wafer boat handling device is configured to load a wafer boat vertically from the rotatable table into the process chamber and to receive the wafer boat from the process chamber onto the rotatable table, a cooldown position in which the wafer boat handling device is configured to cool down a wafer boat, and a transfer position for transferring wafers to and/or from the wafer boat.

Abstract: Vertical furnace reactor assembly, comprising: a reactor housing defining a processing chamber configured for processing substrates therein, the processing chamber having an opening for moving substrates into and out of the processing chamber along a main loading axis, the opening being surrounded by a stack of annular flange units including at least two of a housing flange, a gas divided ring unit, a liner suspension ring unit, a scavenger ring unit and a clamp ring unit, wherein at least two of the annular flange units are provided with mutually cooperating centering structures for centering the respective at least two flange units with respect to each other, wherein the mutually cooperating centering structures comprise a plurality of slots and a corresponding plurality of pins, wherein the slots each extend along a respective main slot axis, wherein the slot axes are directed to mutually intersect centrally with respect to the stack.

Abstract: The disclosure relates to a substrate processing apparatus for processing a plurality of substrates. The apparatus comprising a reactor mounted in the apparatus and configured for processing substrates and a reactor mover for moving the reactor for maintenance. The reactor mover is constructed and arranged with a lift to move the reactor to a lower height to allow for access to the reactor by a maintenance worker.

Abstract: A purge nozzle assembly comprising a purge nozzle body including an inlet opening and an outlet opening. The outlet opening opens into a purge nozzle contact surface. Additionally, the purge nozzle assembly includes a mounting body for connecting the purge nozzle assembly to an external frame member. A mechanical coupling mechanism moveably couples the purge nozzle body with the mounting body and is configured to allow tilting of the purge nozzle body relative to the mounting body as well as to allow a substantial lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement has a movement component which is substantially parallel to the purge nozzle contact surface.

Abstract: A vertical batch furnace assembly, comprising a core tube, an outer casing, a cooling chamber bounded and enclosed by the outer casing and the core tube, and at least one cooling gas supply emanating in the cooling chamber. The core tube has an elongated circumferential wall extending in a longitudinal direction, and is configured to accommodate wafers for processing in the vertical batch furnace. The outer casing extends around the core tube and comprises a heating element for applying a thermal treatment to wafers accommodated in the core tube. The at least one cooling gas supply comprises at least one cooling gas supply opening which is arranged such that the cooling gas enters the cooling chamber with a flow direction which is substantially tangent to the circumferential wall.

Abstract: An injector configured for arrangement within a reactor of a vertical furnace to inject gas in the reactor is provided. The injector is made substantial elongated and configured with an internal gas conduction channel to transport gas from a first end of the injector to a second end of the injector. An outer sidewall of the injector may be tapered towards the second end over at least 10%, preferably 30% and most preferably 50% of the length of the injector to increase tolerances for fitting the injector in the tube.

Abstract: Vertical batch furnace assembly for processing wafers comprising a cassette handling space with a cassette storage, and a cassette handling mechanism. The cassette handling mechanism comprises a cassette handler which is configured to transfer wafer cassettes between cassette storage positions and a wafer transfer position by supporting and moving the wafer cassettes on a cassette handler arm. The cassette handler arm is provided with a detector to detect a cassette in a detection area. The cassette handler moves the detection area of the detector towards one of the cassette storage positions to detect whether a cassette is present.

Abstract: A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace. The wafer boat handling device comprises a main housing having a wall defining and bounding a wafer boat handling space, and a boat transporter comprising a wafer boat support for supporting a wafer boat and configured to transport the wafer boat to a cooldown position within the wafer boat handling space. A part of the wall adjacent the cooldown position is a wall part with a heat radiation surface absorptance of at least 0.60 so as to withdraw heat from the wafer boat which is in the cooldown position by means of heat radiation absorption.

Abstract: Wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, and comprising a rotatable table comprising a first and a second wafer boat support surface. Each wafer boat support surface is configured for supporting a wafer boat. The rotatable table is rotatable by an actuator to rotate both the first and the second wafer support surfaces to a load/receive position in which the wafer boat handling device is configured to load a wafer boat vertically from the rotatable table into the process chamber and to receive the wafer boat from the process chamber onto the rotatable table, a cooldown position in which the wafer boat handling device is configured to cool down a wafer boat, and a transfer position for transferring wafers to and/or from the wafer boat.

Abstract: A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

Abstract: A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

Abstract: A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

Abstract: A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.