Abstract: A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Abstract: A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Abstract: A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.

Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.

Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.

Abstract: A composition includes at least 15 weight percent of a low intrinsic viscosity, bifunctional poly(arylene ether) and at least 20 weight percent of a nonhalogenated solvent. The bifunctional poly(arylene ether)s are substantially and unexpectedly more soluble than their monofunctional analogs. The compositions are useful as concentrates to add bifunctional poly(arylene ether)s to thermosets.

Abstract: A curable composition includes a functionalized poly(arylene ether), a vinyl thermoset resin, and a flame retardant composition. The flame retardant composition includes a trihydrocarbylphosphine oxide and a nitrogen-containing flame retardant that may be melamine phosphate, melamine pyrophosphate, or melamine polyphosphate. The combination of the trihydrocarbylphosphine oxide and the nitrogen-containing flame retardant is particularly effective at improving the flame retardancy of the cured composition at relatively low levels of total flame retardant. A method of preparing the curable composition and articles including the cured composition are also described.

Abstract: A synergistic flame retardant combination includes (a) a phosphorus salt having the formula wherein Md+ is a metal ion or an onium ion; d is 1, 2, 3, or 4 according to the identity of M and its oxidation state; each occurrence of R1 and R2 is independently C1-C18 hydrocarbyl; and each occurrence of m and n is independently 0 or 1; and (b) a phosphine compound selected from trihydrocarbylphosphines, trihydrocarbylphosphine oxides, and combinations thereof. Polymer compositions utilizing the flame retardant combination are described.

Abstract: A synergistic flame retardant combination includes (a) a phosphorus salt having the formula wherein Md+ is a metal ion or an onium ion; d is 1, 2, 3, or 4 according to the identity of M and its oxidation state; each occurrence of R1 and R2 is independently C1-C18 hydrocarbyl; and each occurrence of m and n is independently 0 or 1; and (b) a phosphine compound selected from trihydrocarbylphosphines, trihydrocarbylphosphine oxides, and combinations thereof. Polymer compositions utilizing the flame retardant combination are described.

Abstract: A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.

Abstract: A curable composition includes a functionalized poly(arylene ether), a vinyl thermoset resin, and a flame retardant composition. The flame retardant composition includes a trihydrocarbylphosphine oxide and a nitrogen-containing flame retardant that may be melamine phosphate, melamine pyrophosphate, or melamine polyphosphate. The combination of the trihydrocarbylphosphine oxide and the nitrogen-containing flame retardant is particularly effective at improving the flame retardancy of the cured composition at relatively low levels of total flame retardant. A method of preparing the curable composition and articles including the cured composition are also described.

Abstract: A composition includes at least 15 weight percent of a low intrinsic viscosity, bifunctional poly(arylene ether) and at least 20 weight percent of a nonhalogenated solvent. The bifunctional poly(arylene ether)s are substantially and unexpectedly more soluble than their monofunctional analogs. The compositions are useful as concentrates to add bifunctional poly(arylene ether)s to thermosets.

Abstract: A cured composition is prepared by curing a composition that includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The curable composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. The cured composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.

Abstract: A curable composition includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. After curing, the composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.