Patents by Inventor Christina Marie Pepi

Christina Marie Pepi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Partially underfilled solder grid arrays
    Patent number: 7839002
    Abstract: An electronic device. The device including a module having opposite top surface and bottom surfaces; a first set of pads on the top surface of the module and a second set of pads on the bottom surface of the module substrate, wires within the module electrically connecting the first set of pads to the second set of pads; a set of solder interconnects in electrical and physical contact with a the second set of module pads; and a dielectric underfill layer formed on the bottom surface of the module, the underfill layer filling the space between lower regions of the solder interconnects of the set of solder interconnects, upper regions of the solder interconnects of the set of solder interconnects extending past a top surface of the underfill layer.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: November 23, 2010
    Assignee: International Business Machines Corporation
    Inventors: Stephen Peter Ayotte, Christina Marie Pepi, Timothy M. Sullivan
  • PARTIALLY UNDERFILLED SOLDER GRID ARRAYS
    Publication number: 20090256268
    Abstract: An electronic device and a method of forming the device. The device including a module having opposite top surface and bottom surfaces; a first set of pads on the top surface of the module and a second set of pads on the bottom surface of the module substrate, wires within the module electrically connecting the first set of pads to the second set of pads; a set of solder interconnects in electrical and physical contact with a the second set of module pads; and a dielectric underfill layer formed on the bottom surface of the module, the underfill layer filling the space between lower regions of the solder interconnects of the set of solder interconnects, upper regions of the solder interconnects of the set of solder interconnects extending past a top surface of the underfill layer.
    Type: Application
    Filed: April 15, 2008
    Publication date: October 15, 2009
    Inventors: Stephen Peter Ayotte, Christina Marie Pepi, Timothy M. Sullivan