Patents by Inventor Christina Sue Bennett

Christina Sue Bennett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for processing a substrate
    Patent number: 11260646
    Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: March 1, 2022
    Assignee: CORNING INCORPORATED
    Inventors: Christina Sue Bennett, Raymond Charles Cady, Hyun-Soo Choi, Claire Renata Coble, Byungchul Kim, Timothy Michael Miller, Joseph William Soper, Gary Carl Weber
  • METHODS FOR PROCESSING A SUBSTRATE
    Publication number: 20190275782
    Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
    Type: Application
    Filed: November 13, 2017
    Publication date: September 12, 2019
    Inventors: Christina Sue Bennett, Raymond Charles Cady, Hyun-Soo Choi, Claire Renata Coble, Byungchul Kim, Timothy Michael Miller, Joseph William Soper, Gary Carl Weber