Abstract: A microbolometer pixel unit for detection of terahertz radiation includes a substrate, a thermistor structure, and an optical absorber structure. The thermistor structure includes a plurality of microbolometer pixels disposed on the substrate. Each pixel includes a thermistor platform suspended above the substrate, a thermistor support member holding the thermistor platform, and a thermistor disposed on the thermistor platform and having an electrical resistance that varies in accordance with a temperature of the thermistor.

Abstract: An uncooled microbolometer pixel for detection of electromagnetic radiation is provided that includes a substrate, a thermistor assembly and an absorber assembly. The thermistor assembly includes a thermistor platform suspended above the substrate, one or more thermistors on the thermistor platform, and an electrode structure electrically connecting the thermistors to the substrate. The absorber assembly includes an optical absorber over the thermistor assembly and a reflector provided under and forming a resonant cavity with the optical absorber. The optical absorber is in thermal contact with the thermistors and exposed to the electromagnetic radiation. The optical absorber includes a set of elongated resonators determining an absorption spectrum of the optical absorber.

Abstract: An uncooled microbolometer pixel for detection of electromagnetic radiation is provided that includes a substrate, a thermistor assembly and an absorber assembly. The thermistor assembly includes a thermistor platform suspended above the substrate, one or more thermistors on the thermistor platform, and an electrode structure electrically connecting the thermistors to the substrate. The absorber assembly includes an optical absorber over the thermistor assembly and a reflector provided under and forming a resonant cavity with the optical absorber. The optical absorber is in thermal contact with the thermistors and exposed to the electromagnetic radiation. The optical absorber includes a set of elongated resonators determining an absorption spectrum of the optical absorber.

Abstract: An uncooled microbolometer detector that includes a substrate, a platform held above the substrate by a support structure, at least one thermistor provided on the platform, and an optical absorber. The optical absorber includes at least one electrically conductive layer extending on the platform over and in thermal contact with the at least one thermistor and patterned to form a resonant structure defining an absorption spectrum of the uncooled microbolometer detector. The optical absorber is exposed to electromagnetic radiation and absorbs the electromagnetic radiation according to the absorption spectrum. A microbolometer array including a plurality of uncooled microbolometer detectors arranged in a two-dimensional array is also provided. Advantageously, these embodiments allow extending the absorption spectrum of conventional infrared uncooled microbolometer detectors to the terahertz region of the electromagnetic spectrum.

Abstract: An uncooled microbolometer detector that includes a substrate, a platform held above the substrate by a support structure, at least one thermistor provided on the platform, and an optical absorber. The optical absorber includes at least one electrically conductive layer extending on the platform over and in thermal contact with the at least one thermistor and patterned to form a resonant structure defining an absorption spectrum of the uncooled microbolometer detector. The optical absorber is exposed to electromagnetic radiation and absorbs the electromagnetic radiation according to the absorption spectrum. A microbolometer array including a plurality of uncooled microbolometer detectors arranged in a two-dimensional array is also provided. Advantageously, these embodiments allow extending the absorption spectrum of conventional infrared uncooled microbolometer detectors to the terahertz region of the electromagnetic spectrum.

Abstract: A light modulator comprises a mirror, a substrate provided with at least one electrode, and at least one hinge extending between the substrate and the mirror. The mirror is flexible with the hinge being displaceable for allowing for the displacement and/or the deformation of the mirror. Typically, there are two symmetrically disposed hinges, each including upper and lower arms that define an angle therebetween. The upper arm is connected to the mirror, and the lower arm is mounted to the substrate. The upper and lower arms are adapted to pivot relative to one another thereby allowing the angle to vary and thus allowing the mirror to at least one of displace and deform. When unbiased, the mirror may be plane, convex or concave. When biased, the plane mirror adopts a curved attitude, whereas the curved mirror changes its curvature. The upper and lower arms of each hinge are V-shaped and define an apex. The apexes extend inwardly in a facing relationship.

Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Abstract: In a microbolometer detector the individual transducers in the focal plane array are support by leg members that are attached to the underlying readout integrated circuit (ROIC) chip at locations underneath transducers other than transducer which they support. A variety of configurations are possible. For example, the leg members may be attached to the ROIC chip at locations under adjacent transducers on opposite sides or on the same side of the supported transducer, or at locations underneath transducers that are not immediately adjacent to the supported transducer. In this way the effective length of the leg members and therefore the thermal isolation of the transducer they support can be increased.

Abstract: A light modulator comprises a mirror, a substrate provided with at least one electrode, and at least one hinge extending between the substrate and the mirror. The mirror is flexible with the hinge being displaceable for allowing for the displacement and/or the deformation of the mirror. Typically, there are two symmetrically disposed hinges, each including upper and lower arms that define an angle therebetween. The upper arm is connected to the mirror, and the lower arm is mounted to the substrate. The upper and lower arms are adapted to pivot relative to one another thereby allowing the angle to vary and thus allowing the mirror to at least one of displace and deform. When unbiased, the mirror may be plane, convex or concave. When biased, the plane mirror adopts a curved attitude, whereas the curved mirror changes its curvature. The upper and lower arms of each hinge are V-shaped and define an apex. The apexes extend inwardly in a facing relationship.

Abstract: In a microbolometer detector the individual transducers in the focal plane array are support by leg members that are attached to the underlying readout integrated circuit (ROIC) chip at locations underneath transducers other than transducer which they support. A variety of configurations are possible. For example, the leg members may be attached to the ROIC chip at locations under adjacent transducers on opposite sides or on the same side of the supported transducer, or at locations underneath transducers that are not immediately adjacent to the supported transducer. In this way the effective length of the leg members and therefore the thermal isolation of the transducer they support can be increased.

Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Abstract: The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.