Abstract: The present disclosure relates to a system in package having a chiplet with a first substrate and a first die deposed over the first substrate, a second die, a second substrate that the chiplet and the second die are deposed over, and a heatsink spreader deposed over the chiplet and the second die. Herein, the first substrate includes layered-cake shaped heatsink stanchions that are coupled to the first die, and the second substrate includes layered-cake shaped heatsink stanchions that are coupled to the chiplet and the second die. As such, heat generated by the first die can be dissipated by the heatsink stanchions within the first and second substrates, and heat generated by the second die can be dissipated by the heatsink stanchions within the second substrate. Furthermore, the heat generated by the first die and the second die can be dissipated by the heatsink spreader above them.

Abstract: A system in package (SiP) with an air cavity is disclosed. In one aspect, a technique to bond a lid over the air cavity that reduces the risk of cavity integrity failure is provided. More specifically, an epoxy seal is created on four walls of a lid enclosing the cavity. A further sputtered metal layer is added over the epoxy seal to provide additional structural rigidity, electromagnetic emission suppression and to assist in preventing leaks through the epoxy seal.

Abstract: Multichip module thermal management through backside metal systems and methods are disclosed. In one aspect, a multichip module includes one or more flip chip integrated circuits (ICs), each having a backside to which a metal heat conductor or spreader is attached. The presence of the metal heat conductor on the backside of the flip chip ICs allows for a better thermal path to remove heat from the ICs relative to the substrate. The improved thermal path reduces the likelihood of damage to the ICs or delamination of the module. A variety of methods are proposed to construct the backside metal systems. Additionally, a variety of capture features may be used to assist in structural integrity.

Abstract: A substrate includes a heat slug that is disposed in a cavity in the substrate. An engineered filler material is disposed in the cavity over, under, and/or around the heat slug. The engineered filler material is a thermally conductive particle material having a composition that can be adjusted based on a desired coefficient of thermal expansion. An electronic device can be attached to the substrate over the heat slug and the engineered filler material. The heat slug and the engineered filler material provide, or are part of, a heat transfer dissipation path for the electronic device.

Abstract: The present disclosure relates to a system in package having a chiplet with a first substrate and a first die deposed over the first substrate, a second die, a second substrate that the chiplet and the second die are deposed over, and a heatsink spreader deposed over the chiplet and the second die. Herein, the first substrate includes layered-cake shaped heatsink stanchions that are coupled to the first die, and the second substrate includes layered-cake shaped heatsink stanchions that are coupled to the chiplet and the second die. As such, heat generated by the first die can be dissipated by the heatsink stanchions within the first and second substrates, and heat generated by the second die can be dissipated by the heatsink stanchions within the second substrate. Furthermore, the heat generated by the first die and the second die can be dissipated by the heatsink spreader above them.

Abstract: The present disclosure relates to an air-cavity semiconductor package, which includes a thermal carrier, a ring structure, a package lid, and at least one semiconductor device. The thermal carrier has a carrier body, a heat slug residing within the carrier body, a top coating layer formed over a top surface of the heat slug, and a bottom coating layer formed over a bottom surface of the heat slug. The ring structure includes a ring body with an interior opening, which resides over the thermal carrier, such that a portion of a top surface of the thermal carrier is exposed through the interior opening. The package lid resides over the ring structure and has a recess conjoined with the interior opening forming an enclosed cavity. The at least one semiconductor device is attached to the exposed portion of the top surface of the thermal carrier and encapsulated in the enclosed cavity.

Abstract: The present disclosure relates to an air-cavity semiconductor package, which includes a thermal carrier, a ring structure, a package lid, and at least one semiconductor device. The thermal carrier has a carrier body, a heat slug residing within the carrier body, a top coating layer formed over a top surface of the heat slug, and a bottom coating layer formed over a bottom surface of the heat slug. The ring structure includes a ring body with an interior opening, which resides over the thermal carrier, such that a portion of a top surface of the thermal carrier is exposed through the interior opening. The package lid resides over the ring structure and has a recess conjoined with the interior opening forming an enclosed cavity. The at least one semiconductor device is attached to the exposed portion of the top surface of the thermal carrier and encapsulated in the enclosed cavity.

Abstract: A coupling structure for a microwave filter including at least one coupling rod located adjacent a transformer.

Abstract: In one aspect of the present invention there is provided a portable test apparatus 100 for a communications device/system said apparatus including, a display 103 for displaying test information from the communications device/system, a filter assembly 122 and a control assembly 124 comprising at least one printed circuit board and a housing wherein the at least one printed circuit board and the housing co-operate to electrically isolate one or more components disposed on said at least one printed circuit board.

Abstract: A multiband filtering apparatus (40) for use in a communications system, said apparatus including a housing (21); a plurality of cavities (22.1, 22.2) disposed within said housing wherein each cavity includes a resonant structure, the resonant structure having at least one ceramic element (23.1, 23.2); at least one input port (27) coupled to a first resonator of said plurality of resonators; at least one output port (28) coupled to a second resonator of said plurality of resonators; and a closure member (25) adapted to engage said housing (21) and cap said cavities.

Abstract: A filter filtering microwaves, the filter comprising a cavity and at least one metal comb-line resonator located within the cavity and at least one dielectric member surrounding the at least one metal comb-line resonator.

Abstract: In one aspect of the present invention there is provided a portable test apparatus 100 for a communications device/system said apparatus including, a display 103 for displaying test information from the communications device/system, a filter assembly 122 and a control assembly 124 comprising at least one printed circuit board and a housing wherein the at least one printed circuit board and the housing co-operate to electrically isolate one or more components disposed on said at least one printed circuit board.

Abstract: A multiband filtering apparatus (40) for use in a communications system, said apparatus including a housing (21); a plurality of cavities (22.1, 22.2) disposed within said housing wherein each cavity includes a resonant structure, the resonant structure having at least one ceramic element (23.1, 23.2); at least one input port (27) coupled to a first resonator of said plurality of resonators; at least one output port (28) coupled to a second resonator of said plurality of resonators; and a closure member (25) adapted to engage said housing (21) and cap said cavities.