Abstract: A method is provided for fabricating a construction (10) having a functional side (12). The method includes the steps of: supplying a flexible substrate (20); attaching one or more structures (30) to the substrate (20) on a surface or side thereof facing the functional side (12) of the construction (10); and forming one or more features, for example, such as fibrils (39), on at least one of the structures (30), wherein the features have at least one dimension which is at least one of micro-sized or nano-sized.

Abstract: A method is provided for fabricating a construction (10) having a functional side (12). The method includes the steps of: supplying a flexible substrate (20); attaching one or more structures (30) to the substrate (20) on a surface or side thereof facing the functional side (12) of the construction (10); and forming one or more features, for example, such as fibrils (39), on at least one of the structures (30), wherein the features have at least one dimension which is at least one of micro-sized or nano-sized.

Abstract: A heat-transfer imaging system and a method of using the same. The heat-transfer imaging system includes a heat-transfer sheet and an activating ink. The heat-transfer sheet and the activating ink are specially formulated so that only the areas of the heat-transfer sheet onto which the ink has been printed become adhesive under heat-transfer conditions. This effect may be achieved by designing the sheet to include an ink-receptive coating whose melting temperature is higher than that typically encountered during normal heat-transfer conditions and by formulating the activating ink to include a plasticizer that, when printed onto the ink-receptive coating, lowers the melting temperature of the ink-receptive coating sufficiently so that the modified melting temperature falls within the temperature range encountered during heat-transfer.

Abstract: The present invention relates to a pressure sensitive label for use in a cold transfer process that can be used for garment identification and labeling. The pressure sensitive label can be applied on textile surface or any other surfaces for which heat transfer is unfavorable or unavailable. The pressure sensitive label can remain on the substrate to which it is attached through repeated washing and drying cycles.

Abstract: A heat-transfer imaging system and a method of using the same. The heat-transfer imaging system includes a heat-transfer sheet and an activating ink. The heat-transfer sheet and the activating ink are specially formulated so that only the areas of the heat-transfer sheet onto which the ink has been printed become adhesive under heat-transfer conditions. This effect may be achieved by designing the sheet to include an ink-receptive coating whose melting temperature is higher than that typically encountered during normal heat-transfer conditions and by formulating the activating ink to include a plasticizer that, when printed onto the ink-receptive coating, lowers the melting temperature of the ink-receptive coating sufficiently so that the modified melting temperature falls within the temperature range encountered during heat-transfer.

Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers.