Abstract: A ball grid pad for connecting a ball grid array package to a printed circuit board includes a circular pad area adhered on a ball grid connection surface. A solder mask on the ball grid connection surface has an opening surrounding and spaced apart from the circular pad area. The ball pad includes an anchor trace on the ball grid connection surface wherein the ball pad conductor material extends radially from the edge of the circular pad area to a terminating point beyond the opening of the solder mask so that a portion of the anchor trace is covered by the solder mask. The ball grid connection surface may be an integrated circuit package substrate or a printed circuit board surface.