Abstract: A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-°C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Abstract: A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-.degree. C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Abstract: Permanent indicia can be applied to a surface comprising a composition comprising about 35 to about 75% of a polymeric component having dispersed therein about 25 to about 65% of a filler component comprising: i) about 2 to about 65% of an insoluble, infusible particulate, active filler having a mean particle size less than about 2.5 micron and a surface area greater than about 10 m.sup.2 /g: and (ii) up to about 63% of an insoluble, infusible, particulate, inert filler. The polymeric component should be polar, e.g. by the use of a polymer containing polar groups or adding a polar additive to the composition.

Abstract: High strength fibers of polymeric material and having outstanding tensile strength, Young's modulus values, and creep resistance are prepared by treating a fiber from a polymeric material, which may contain a crosslinking promoter, by (a) crosslinking the polymeric material; (b) heating the fiber to a temperature, T.sub.1, which (i) in the event the polymer is amorphous, is above the glass transition temperature (Tg) of the polymer and, (ii) in the event the polymer is crystalline, is above the second order transition temperature, T.sub..alpha..sbsb.c, and below the crystalline melting temperature (Tm) of the polymer; (c) drawing the fiber to a draw ratio of at least about 2 at a rate of at least about 200% per minute and (d) cooling the fiber.

Abstract: High strength fibers of a polymeric material and having outstanding tensile strength, Young's modulus values, and creep resistance are prepared by treating a fiber from a polymeric material, which may contain a crosslinking promoter, by (a) crosslinking the polymeric material; (b) heating the fiber to a temperature, T.sub.1, which (i) in the event the polymer is amorphous, is above the glass transition temperature (Tg) of the polymer and, (ii) in the event the polymer is crystalline, is above the second order transition temperature, T.sub..alpha..sbsb.c, and below the crystalline melting temperature (Tm) of the polymer; (c) drawing the fiber to a draw ratio of at least about 2 at a rate of at least about 200% per minute and (d) cooling the fiber.

Abstract: In a laminate comprising adjacent layers composed of incompatible polymers, the adhesion between the layers is enhanced by irradiation of the laminate, and can be further enhanced by high temperature annealing of the irradiated laminate.

Abstract: Poly(aryl ether ketones) are stabilized against crosslinking and thermooxidative degradation at elevated temperatures, e.g. temperatures typically used to melt process the polymer, by incorporating therein a particulate molecular sieve, for example, a crystalline aluminosilicate, such as a synthetic zeolite. The amount of molecular sieve is preferably about 0.5 to about 5% by weight based on the weight of the poly(aryl ether ketone).

Abstract: The high temperature aging of polyamides is substantially improved by incorporating therein an antioxidant and an oxide of a metal of Group II or III of the Periodic Table, preferably a crystalline aluminosilicate such as a synthetic zeolite. The amount of antioxidant is preferably 1 to 5% and the amount of metal oxide is preferably 0.5 to 5%. Polyamides which can be stabilized in this way include Nylon-6, Nylon-11 and Nylon-12.