Patents by Inventor Christine Ferrandon

Christine Ferrandon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connectors having a bent main body for electrical connection between a housing and a support, and being disposed as a grid array or network
    Patent number: 10320097
    Abstract: An electrical connector allowing a connection between two substantially facing electrical contacts respectively pertaining to a housing and a support, and including a main body including a first end for secure connection thereof to the housing and a second end for secure connection thereof to the support, the main body being bent in at least one bending area.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: June 11, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Francois De Crecy, Bernard Diem, Christine Ferrandon, Thierry Hilt
  • CONNECTOR FOR MATRIX CONNECTION BETWEEN A HOUSING AND A SUPPORT, COMPRISING A BENT MAIN BODY
    Publication number: 20170222340
    Abstract: An electrical connector allowing a connection between two substantially facing electrical contacts respectively pertaining to a housing and a support, and including a main body including a first end for secure connection thereof to the housing and a second end for secure connection thereof to the support, the main body being bent in at least one bending area.
    Type: Application
    Filed: August 5, 2015
    Publication date: August 3, 2017
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Francois DE CRECY, Bernard DIEM, Christine FERRANDON, Thierry HILT
  • Method to fabricate a substrate including a material disposed on the edge of one or more non through hole formed in the substrate
    Patent number: 9277656
    Abstract: Method for producing a substrate comprising at least one getter material arranged on the walls of at least one blind hole, comprising at least the steps of: etching the blind hole through a first face of the substrate, depositing a continuous layer of getter material on the whole of the first face of the substrate and at least on the side walls of the blind hole, etching part of the layer of getter material located on the first face of the substrate such that said first face of the substrate is no longer covered by the getter material, in which the step of etching part of the layer of getter material comprises the implementation of an etching by ion beam machining, or chemical-mechanical planarization or polishing.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: March 1, 2016
    Assignee: Comissariat a l'énergie atomique et aux énergies alternatives
    Inventors: Sophie Giroud, Christine Ferrandon
  • METHOD TO FABRICATE A SUBSTRATE INCLUDING A MATERIAL DISPOSED ON THE EDGE OF ONE OR MORE NON THROUGH HOLE FORMED IN THE SUBSTRATE
    Publication number: 20150156890
    Abstract: Method for producing a substrate comprising at least one getter material arranged on the walls of at least one blind hole, comprising at least the steps of: etching the blind hole through a first face of the substrate, depositing a continuous layer of getter material on the whole of the first face of the substrate and at least on the side walls of the blind hole, etching part of the layer of getter material located on the first face of the substrate such that said first face of the substrate is no longer covered by the getter material, in which the step of etching part of the layer of getter material comprises the implementation of an etching by ion beam machining, or chemical-mechanical planarization or polishing.
    Type: Application
    Filed: November 24, 2014
    Publication date: June 4, 2015
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Sophie GIROUD, Christine FERRANDON
  • Packaging structure of a micro-device including a getter material
    Patent number: 8981544
    Abstract: A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: March 17, 2015
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Xavier Baillin, Christine Ferrandon
  • Getter structure with optimized pumping capacity
    Patent number: 8912620
    Abstract: Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different thicknesses and of which the surface grain densities are different from one another.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: December 16, 2014
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Christine Ferrandon, Xavier Baillin
  • GETTER STRUCTURE WITH OPTIMIZED PUMPING CAPACITY
    Publication number: 20130015568
    Abstract: Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different thicknesses and of which the surface grain densities are different from one another.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 17, 2013
    Applicant: Commissariat a I'energie atomique et aux ene alt
    Inventors: Christine FERRANDON, Xavier BAILLIN
  • PACKAGING STRUCTURE OF A MICRO-DEVICE INCLUDING A GETTER MATERIAL
    Publication number: 20120112334
    Abstract: A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 10, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Xavier BAILLIN, Christine Ferrandon