Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.

Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.

Abstract: An antenna apparatus is provided, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.

Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.

Abstract: The invention refers to an antenna apparatus, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.

Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.

Abstract: A chip module comprises a chip with a chip contact, an insulating structure, which covers the chip and the chip contact at least partly, and a spare contact at an external surface of the insulating structure and a conductive trace for electrically connecting the chip contact to the spare contract.

Abstract: A chip module comprises a chip with a chip contact, an insulating structure, which covers the chip and the chip contact at least partly, and a spare contact at an external surface of the insulating structure and a conductive trace for electrically connecting the chip contact to the spare contract.

Abstract: A semiconductor substrate has an underbump metallization for solder materials. The semiconductor substrate has applied thereto a titanium layer serving as a diffusion barrier and as a wettable surface for the solder-material bump. The solder-material bump is adapted to be applied directly to said diffusion barrier.

Abstract: A method for the temporary fixing of an electronic component (10) having elevated contact metallizations (11) to a substrate (17) provided with terminal surfaces (16) for a subsequent thermal connection of the contact metallizations to the terminal surfaces, wherein a bonding agent is applied to the component and/or the substrate and wherein the bonding agent used is an alcoholic liquid medium containing an alcohol (13) whose surface tension is used to form bonding forces between the contact metallizations and the terminal surfaces and whose boiling point is below the melting temperature of the contact metallizations (11).