Patents by Inventor Christine Tsau

Christine Tsau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alternative to desmear for build-up roughening and copper adhesion promotion
    Patent number: 8268724
    Abstract: In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: September 18, 2012
    Assignee: Intel Corporation
    Inventors: Houssam Jomaa, Christine Tsau
  • ALTERNATIVE TO DESMEAR FOR BUILD-UP ROUGHENING AND COPPER ADHESION PROMOTION
    Publication number: 20100059891
    Abstract: In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 11, 2010
    Inventors: Houssam Jomaa, Christine Tsau
  • Alternative to desmear for build-up roughening and copper adhesion promotion
    Patent number: 7638877
    Abstract: In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: December 29, 2009
    Assignee: Intel Corporation
    Inventors: Houssam Jomaa, Christine Tsau
  • Alternative to desmear for build-up roughening and copper adhesion promotion
    Publication number: 20080001267
    Abstract: In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Houssam Jomaa, Christine Tsau