Abstract: An implantable sensor (1) for determining at least one parameter, in particular a physical parameter, comprises a sensor body (3). The sensor body (3) is responsive to the at least one parameter and is configured to yield at least one response signal (SR) upon an interrogation of the sensor body (3) with at least one interrogation signal (SI) comprising acoustic waves. The at least one response signal (SR) is associated with the at least one parameter. The sensor body (3) comprises or consists of at least one material having an ordered structure (4). The at least one response signal (SR) is associated with one or more bulk effects of the at least one material having an ordered structure (4).

Abstract: The invention relates to a method for the manufacturing of a carrying device, a carrying device, a system for detection and a method for detection of at least one physical parameter and/or chemical composition. A method for the manufacturing of a carrying device for reception of at least one sensor is presented, in which a receiving body with a surface to be coated is provided. In the receiving body, a space is provided which is open on the side of this surface. A second body with a sealing surface is provided. This sealing surface is positioned in such a manner that the surface to be coated of the receiving body is sealed by the second body at least in the circumference of the space in the receiving body. A formable or moldable filling material is provided in the space in such a manner that the filling material forms a surface shaped complementary to the sealing surface of the second body, closing the space.

Abstract: The invention relates to a method for the manufacturing of a carrying device, a carrying device, a system for detection and a method for detection of at least one physical parameter and/or chemical composition. A method for the manufacturing of a carrying device for reception of at least one sensor is presented, in which a receiving body with a surface to be coated is provided. In the receiving body, a space is provided which is open on the side of this surface. A second body with a sealing surface is provided. This sealing surface is positioned in such a manner that the surface to be coated of the receiving body is sealed by the second body at least in the circumference of the space in the receiving body. A formable or moldable filling material is provided in the space in such a manner that the filling material forms a surface shaped complementary to the sealing surface of the second body, closing the space.

Abstract: A mechanical transducer for the detection of acoustic and/or seismic signals is indicated, comprising a continuous or discrete coupled mass-spring network with varying masses and/or spring constants. The mass-spring network is adapted to transform a comparatively small-dimensioned motion parameter of a first mass element into a comparatively large-dimensioned motion parameter of a further mass element. Between the first mass element and the further mass element, the mass-spring network comprises one or more intermediate mass elements, which are coupled to the first mass element and the further mass element by means of spring elements.

Abstract: State-of-the-art synthesis of carbon nanostructures (25) by chemical vapor deposition involve heating a catalyst material to high temperatures up 700-1000° C. in a furnace and flowing hydrocarbon gases through the reactor over a period of time. In order to enable a self assembly of nanostructures (25) on microchips (10) without damaging the microchip (10) by high temperatures the proposed manufacturing method comprises: A layer (1) contains indentations (3) on which nanostructures (25) are to be integrated and the indentations (3) are heated up by a current (I) conducted to the layer (1) via contact pads (2).

Abstract: State-of-the-art synthesis of carbon nanostructures (25) by chemical vapor deposition involve heating a catalyst material to high temperatures up 700-1000° C. in a furnace and flowing hydrocarbon gases through the reactor over a period of time. In order to enable a self assembly of nanostructures (25) on microchips (10) without damaging the microchip (10) by high temperatures the proposed manufacturing method comprises: A layer (1) contains indentations (3) on which nanostructures (25) are to be integrated and the indentations (3) are heated up by a current (I) conducted to the layer (1) via contact pads (2).

Abstract: The resolution and the signal-to-noise ration of known force sensors as e.g. capacitive force sensors decrease when scaling them down. To solve this problem there is a solution presented by the usage of a nanostructure as e.g. a carbon nanotube, which is mechanically deformed by a force to be measured. The proposed force sensors comprises a support with two arms carrying the carbon nanotube. The main advantage of this nanoscale force sensor is a very high sensitivity as the conductance of carbon nanotubes changes several orders of magnitude when a mechanical deformation arises.

Abstract: The resolution and the signal-to-noise ration of known force sensors as e.g. capacitive force sensors decrease when scaling them down. To solve this problem there is a solution presented by the usage of a nanostructure as e.g. a carbon nanotube, which is mechanically deformed by a force to be measured. The proposed force sensors comprises a support with two arms carrying the carbon nanotube. The main advantage of this nanoscale force sensor is a very high sensitivity as the conductance of carbon nanotubes changes several orders of magnitude when a mechanical deformation arises.

Abstract: A stocking system including at least one support for goods to be stocked, a communications network, and a computing unit for deriving inventory data. The stocking system has a gravimetric sensor element that, for detecting the goods, is in the form of a sensor array or sensor matrix. This sensor element can also be supplemented with an optical sensor element. By recording a multitude of measured values of the goods, the entire stocking system can be in the form of a sensor network and, with regard to the model, is configured for deriving inventory data whereby enabling both an identification of the type of the stocked goods as well as the determination of the quantity thereof.

Abstract: A reference image for pattern recognition tasks is produced. Overlapping individual images are combined to form an overall image and the overall image is used as the reference image. This allows the size of reference images for fingerprints, for instance, which has hitherto been governed by the sensor area, to be increased. The recognition rate can thus be improved.

Abstract: A first capacitor electrode and at least part of a second capacitor electrode of a capacitor are produced in depressions of an auxiliary layer by electroplating. The auxiliary layer is then removed and at least partially replaced by a capacitor dielectric. The first capacitor electrode and the part of the second capacitor electrode may be composed of a metal, for example platinum. The capacitor dielectric can be composed, for example, of barium-strontium-titanate.

Abstract: A first capacitor electrode and at least part of a second capacitor electrode of a capacitor are produced in depressions of an auxiliary layer by electroplating. The auxiliary layer is then removed and at least partially replaced by a capacitor dielectric. The first capacitor electrode and the part of the second capacitor electrode may be composed of a metal, for example platinum. The capacitor dielectric can be composed, for example, of barium-strontium-titanate.

Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Abstract: The valve seat is located between an inlet opening and an outlet opening, with a connecting stub against which an elastic membrane presses. The membrane is disposed above a cavity and formed by a part of a polysilicon layer. When a medium flows onto the side of the membrane facing the connecting stub, the membrane is lifted off the connecting stub and is pulled into the cavity, so that the medium can flow through the valve. The membrane can be stiffened by a stamp-like attachment, in order to ensure that the valve opens uniformly.

Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Abstract: A micromechanical sensor is described which contains electrodes that are disposed on a substrate, and electrode bars made of silicon that can move with regard to the electrodes. A deformation of the substrate is measured by determining differential changes in a capacity of the electrode bars in comparison to adjacently disposed electrodes. Two groups of electrode bars are preferably used which are interlocked with one another in an alternating comb-like manner, which, are separate from one another, and are interconnected at the ends thereof in an electrically conductive manner, and which are anchored on the substrate.

Abstract: A semiconductor component comprising a layer of semiconductor material that is doped region-by-region in alternating fashion for positive and negative electrical conductivities. This layer is arranged perpendicular to layer surfaces between thermally conductive layers in such a way that the junctions between two successive regions having different electrical conductivities are electrically insulated outwardly, and are alternately in thermal contact with one of the thermally conductive layers and are thermally insulated from the respective other thermally conductive layer.

Abstract: A bearing pressure exerted on the finger print sensor or a change in this bearing pressure is ascertained using defined grey-scale value portions of one or more successively recorded finger print images, and in the event of a specific bearing pressure being exceeded and/or undershot or in the event of a predetermined dimension for the change in the bearing pressure being exceeded, a control signal and/or useful signal is generated or a function of the finger print sensor or of an electrical or electronic device connected thereto is controlled or switched.

Abstract: Method for manufacturing an absolute pressure sensor as micromechanical component on a silicon substrate, whereby a cavity (4) is etched out in an auxiliary layer (3) under a membrane layer (5) through etching openings (6), the etching openings are closed with a passivation layer (7), whereby a specific etching opening (11) is re-opened in a via hole etching and this opening is re-closed with a metallization or dielectric material (10, 12) in a following process step that ensues at low pressure.

Abstract: In a relative pressure sensor or miniaturized microphone as a micromechanical sensor component, a polysilicon membrane is arranged over a polysilicon membrane of an SOI substrate. A recess that is connected to the cavity between the membrane and the body silicon layer by openings in the body silicon layer is present in the substrate on the back side. Given an excursion of the membrane, a pressure equalization can therefore occur in the cavity as a result of these openings. The measurement occurs capacitatively by electrical connection of the electrically conductively doped membrane and a doped region formed in the body silicon layer.