Patents by Inventor Christoph B. Luechinger

Christoph B. Luechinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLAR SUBSTRATE RIBBON BONDING SYSTEM
    Publication number: 20120273554
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
    Type: Application
    Filed: July 2, 2012
    Publication date: November 1, 2012
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Christoph B. Luechinger, Orlando L. Valentin
  • SOLAR SUBSTRATE RIBBON BONDING SYSTEM
    Publication number: 20120080507
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 5, 2012
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Christoph B. Luechinger, Orlando L. Valentin
  • RIBBON BONDING IN AN ELECTRONIC PACKAGE
    Publication number: 20100214754
    Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
    Type: Application
    Filed: May 7, 2010
    Publication date: August 26, 2010
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventor: Christoph B. Luechinger
  • Ribbon bonding in an electronic package
    Patent number: 7745253
    Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: June 29, 2010
    Assignee: Orthodyne Electronics Corporation
    Inventor: Christoph B. Luechinger
  • Integrated circuit package system including ribbon bond interconnect
    Patent number: 7443018
    Abstract: An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: October 28, 2008
    Assignees: Stats Chippac Ltd., Orthodyne Electronics Corporation
    Inventors: You Yang Ong, Kwang Yong Chung, Mohd Helmy Bin Ahmad, Garrett L. Wong, Christoph B. Luechinger
  • Ribbon bonding
    Publication number: 20040217488
    Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
    Type: Application
    Filed: May 2, 2003
    Publication date: November 4, 2004
    Inventor: Christoph B. Luechinger