Patents by Inventor Christoph Benno Luechinger
Christoph Benno Luechinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11465224Abstract: An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.Type: GrantFiled: June 16, 2021Date of Patent: October 11, 2022Assignee: Kulicke and Soffa Industries, Inc.Inventor: Christoph Benno Luechinger
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Publication number: 20210394292Abstract: An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.Type: ApplicationFiled: June 16, 2021Publication date: December 23, 2021Inventor: Christoph Benno Luechinger
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Patent number: 10763236Abstract: A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).Type: GrantFiled: January 9, 2019Date of Patent: September 1, 2020Assignee: Kulicke and Soffa Industries, Inc.Inventors: Peter J. Klaerner, Jason Fu, Christoph Benno Luechinger
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Patent number: 10562127Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.Type: GrantFiled: April 30, 2018Date of Patent: February 18, 2020Assignee: Kulicke and Soffa Industries, Inc.Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
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Publication number: 20190214363Abstract: A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).Type: ApplicationFiled: January 9, 2019Publication date: July 11, 2019Inventors: Peter J. Klaerner, Jason Fu, Christoph Benno Luechinger
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Publication number: 20180243856Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.Type: ApplicationFiled: April 30, 2018Publication date: August 30, 2018Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
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Patent number: 9981336Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.Type: GrantFiled: October 31, 2016Date of Patent: May 29, 2018Assignee: Kulicke and Soffa Industries, Inc.Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
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Publication number: 20170120372Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.Type: ApplicationFiled: October 31, 2016Publication date: May 4, 2017Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
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Patent number: 8926760Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: GrantFiled: February 19, 2010Date of Patent: January 6, 2015Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Erich Christoph Mueller, Orlando Luis Valentin, Tao Xu
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Patent number: 8651354Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: GrantFiled: July 18, 2011Date of Patent: February 18, 2014Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20130112735Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: ApplicationFiled: July 18, 2011Publication date: May 9, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8308050Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: July 2, 2012Date of Patent: November 13, 2012Assignee: Orthodyne Electronics CorporaitionInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8251274Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: April 19, 2012Date of Patent: August 28, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120205028Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: ApplicationFiled: April 19, 2012Publication date: August 16, 2012Applicant: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8231044Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: October 3, 2011Date of Patent: July 31, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8196798Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: October 10, 2011Date of Patent: June 12, 2012Assignee: Kulicke and Soffa Industries, Inc.Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120085812Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: ApplicationFiled: October 10, 2011Publication date: April 12, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20110308545Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: ApplicationFiled: February 19, 2010Publication date: December 22, 2011Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Erich Christoph Mueller, Orlando Luis Valentin, Tao Xu
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Patent number: 7934633Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.Type: GrantFiled: April 15, 2008Date of Patent: May 3, 2011Assignee: Orthodyne Electronics CorporationInventors: Mark Arnold Delsman, Christoph Benno Luechinger
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Patent number: 7909228Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.Type: GrantFiled: April 15, 2008Date of Patent: March 22, 2011Assignee: Orthodyne Electronics CorporationInventors: Mark Arnold Delsman, Christoph Benno Luechinger