Abstract: In various embodiments, a level shifter and a method for operating the same are provided. The level shifter may include a low supply voltage terminal, a high supply voltage terminal, at least one input terminal, at least one output terminal, and a latch. The latch may configured to: store a predetermined logic state by setting a storage node to a voltage level in response to receiving a predetermined voltage level at the at least one input terminal; amend the voltage level at the storage node in response to receiving an amended voltage/s at the low supply voltage terminal and/or at the high supply voltage terminal; and output the predetermined logic state having the amended voltage level from the storage node to the at least one output.

Abstract: In various embodiments, a level shifter is provide. The level shifter includes a low supply voltage terminal, a high supply voltage terminal, at least one input terminal, at least one output terminal, and a latch. The latch is configured: to store a predetermined logic state by setting a storage node to a voltage level in response to receiving a predetermined voltage level at the at least one input terminal; to amend the voltage level at the storage node in response to receiving an amended voltage/s at the low supply voltage terminal and/or at the high supply voltage terminal; and to output the predetermined logic state having the amended voltage level from the storage node to the at least one output.

Abstract: According to various embodiments, a semiconductor substrate arrangement may be provided, wherein the semiconductor substrate arrangement may include: a semiconductor substrate defining a first area at a first level and a second area next to the first area at a second level, wherein the first level is lower than the second level; a plurality of planar non-volatile memory structures disposed over the semiconductor substrate in the first area; and a plurality of planar transistor structures disposed over the semiconductor substrate in the second area.

Abstract: A method of parallel forming of memory cells, and an apparatus including a memory and a multiplexer. The memory has an array of memory cells and bit lines, wherein each of the bit lines is associated with a plurality of the memory cells. The multiplexer has a plurality of outputs coupled to a plurality of the respective bit lines. The multiplexer is configured to select in parallel a plurality of the bit lines by applying a forming bias voltage, detect formation of one or more memory cells associated with the selected bit lines, and disconnect from the forming bias voltage any formed memory cells.

Abstract: A method for manufacturing a memory cell in accordance with various embodiments may include: forming at least one charge storing memory cell structure over a substrate, the charge storing memory cell structure having a first sidewall and a second sidewall opposite the first sidewall; forming an electrically conductive layer over the substrate and the charge storing memory cell structure; patterning the electrically conductive layer to form a spacer at the first sidewall and a blocking structure at the second sidewall of the charge storing memory cell structure; implanting first dopant atoms to form a first doped region in the substrate proximate the spacer, wherein the first dopant atoms are blocked by the blocking structure; removing the blocking structure after implanting the first dopant atoms; implanting second dopant atoms to form a second doped region in the substrate proximate the second sidewall of the charge storing memory cell structure.

Abstract: A method for manufacturing a memory cell in accordance with various embodiments may include: forming at least one charge storing memory cell structure over a substrate, the charge storing memory cell structure having a first sidewall and a second sidewall opposite the first sidewall; forming an electrically conductive layer over the substrate and the charge storing memory cell structure; patterning the electrically conductive layer to form a spacer at the first sidewall and a blocking structure at the second sidewall of the charge storing memory cell structure; implanting first dopant atoms to form a first doped region in the substrate proximate the spacer, wherein the first dopant atoms are blocked by the blocking structure; removing the blocking structure after implanting the first dopant atoms; implanting second dopant atoms to form a second doped region in the substrate proximate the second sidewall of the charge storing memory cell structure.

Abstract: A structure and method for increasing the operating speed and reducing the overall programming time of a memory array are provided herein. The method and structure reduce the maximum write current consumption, for writing a plurality of data bits to a NVM array, by writing the data bits sharing an activated word line at different times (e.g., activating bit lines associated with an activated word line at different times). The write operation of respective data bits, which individually utilize only a fraction of the overall write window of the bits, are interleaved so that the maximum write current of respective bits are offset in time from the maximum write current of another bit, allowing a larger number of data bits to be written without exceeding system specifications (e.g., maximum current) and reducing overall memory write time.

Abstract: The disclosed invention provides a structure and method for increasing the operating speed and reduce the overall programming time of a memory array. In one embodiment, the method and structure provided herein reduce the maximum write current consumption, for writing a plurality of data bits to a NVM array, by writing the data bits sharing an activated word line at different times (e.g., activating bit lines associated with an activated word line at different times). Specifically, the write operation of respective data bits, which individually utilize only a fraction of the overall write window of the bits, are interleaved so that the maximum write current of respective bits are offset in time from the maximum write current of another bit. This interleaving of data bit write windows allows a larger number of data bits to be written without exceeding system specifications (e.g., maximum current) reducing overall memory write time.