Abstract: A composite component, a motor vehicle component or a building component comprising the composite component, to a method for producing the composite component and to the use of the composite component.

Abstract: A fiber composite component, and to a system including a fiber composite component and an analytical unit.

Abstract: A textile product (1) comprising individual elements (4) interconnected by a textile technique, characterized in that the interconnected individual elements (4) hold at least one decorative or functional element (2, 2?, 2?, 12, 12?, 22) between each other, e.g. by braiding in or braiding around.

Abstract: A mandrel for manufacturing a three-dimensional structure from a composite material. The external surface of the mandrel can at least partially correspond to the inner surface of the three-dimensional structure. The mandrel can include a plurality of expandable particles configured to increase responsive to a threshold condition. The mandrel can be configured to crack responsive to a triggering condition.

Abstract: A mandrel for manufacturing a three-dimensional structure from a composite material. The external surface of the mandrel can at least partially correspond to the inner surface of the three-dimensional structure. The mandrel can include a plurality of expandable particles configured to increase responsive to a threshold condition. The mandrel can be configured to crack responsive to a triggering condition.

Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

Abstract: An arrangement (1) for connecting an elongate element (2) used in particular for absorbing and/or transmitting tensile and/or torsional forces to a further component (3) comprises a force introduction element (4) with a side facing the further component (3) and a side facing away from the further component (3) and an encasing element (5) having a closed cross-section, said encasing element encasing the force introduction element (4) at least in some sections and projecting over the force introduction element (4) on its side which faces away from the further component (3). Projections (6) are provided on at least one section of the force introduction element (4) on its outer surface facing the encasing element (5), said projections penetrating the encasing element (5) at least partially.

Abstract: A textile product (1) comprising individual elements (4) interconnected by a textile technique, characterised in that the interconnected individual elements (4) hold at least one decorative or functional element (2, 2?, 2?, 12, 12?, 22) between each other, e.g. by braiding in or braiding around.