Patents by Inventor Christoph Flotgen
Christoph Flotgen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11270902Abstract: An electrostatic substrate holder for accommodating and holding a substrate, a method for processing a substrate, and a processing plant. The electrostatic substrate holder includes a stator having electrodes that generate an electrostatic holding force for fixing the substrate.Type: GrantFiled: March 9, 2017Date of Patent: March 8, 2022Assignee: EV Group E. Thallner GmbHInventor: Christoph Flotgen
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Patent number: 11139170Abstract: A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. The workspace includes a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: GrantFiled: August 14, 2019Date of Patent: October 5, 2021Assignee: EV GROUP E. THALLNER GMBHInventors: Markus Wimplinger, Viorel Dragoi, Christoph Flotgen
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Patent number: 10825793Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: November 3, 2020Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 10707059Abstract: A device for bombarding at least one substrate with a plasma with a first electrode and a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.Type: GrantFiled: May 9, 2014Date of Patent: July 7, 2020Assignee: EV Group E. Thallner GmbHInventors: Thomas Glinsner, Christoph Flotgen, Johann Bernauer, Thomas Wagenleitner, Thomas Wieser, Florian Schmid, Thomas Plach, Roman Anzengruber, Alexander Nones, Uwe Kriebisch
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Publication number: 20190371607Abstract: A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. The workspace includes a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Applicant: EV GROUP E. THALLNER GMBHInventors: Markus WIMPLINGER, Viorel DRAGOI, Christoph FLOTGEN
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Publication number: 20190355606Abstract: An electrostatic substrate holder for accommodating and holding a substrate, a method for processing a substrate, and a processing plant. The electrostatic substrate holder includes a stator having electrodes that generate an electrostatic holding force for fixing the substrate.Type: ApplicationFiled: March 9, 2017Publication date: November 21, 2019Applicant: EV Group E. Thallner GmbHInventor: Christoph Flotgen
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Patent number: 10438798Abstract: A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. The workspace includes a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: GrantFiled: January 5, 2018Date of Patent: October 8, 2019Assignee: EV GROUP E. THALLNER GMBHInventors: Markus Wimplinger, Viorel Dragoi, Christoph Flotgen
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Publication number: 20190006313Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: August 21, 2018Publication date: January 3, 2019Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Patent number: 10083933Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: December 21, 2015Date of Patent: September 25, 2018Assignee: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Publication number: 20180130658Abstract: A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. The workspace includes a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: ApplicationFiled: January 5, 2018Publication date: May 10, 2018Applicant: EV GROUP E. THALLNER GMBHInventors: Markus WIMPLINGER, Viorel DRAGOI, Christoph FLOTGEN
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Patent number: 9899223Abstract: A device and method for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate with the following features: a workspace that can be closed, gas-tight, against the environment and can be supplied with a vacuum, the workspace comprises: a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: GrantFiled: September 25, 2013Date of Patent: February 20, 2018Assignee: EV GROUP E. THALLNER GMBHInventors: Markus Wimplinger, Viorel Dragoi, Christoph Flotgen
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Publication number: 20170229423Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a first reservoir in a surface layer on the first contact surface and a second reservoir in a surface layer on the second contact surface, the surface layers of the first and second contact surfaces being comprised of respective native oxide materials of one or more second educts respectively contained in reaction layers of the first and second substrates, partially filling the first and second reservoirs with one or more first educts; and reacting the first educts filled in the first reservoir with the second educts contained in the reaction layer of the second substrate to at least partially strengthen a permanent bond formed between the first and second contact surfaces.Type: ApplicationFiled: April 27, 2017Publication date: August 10, 2017Applicant: EV GROUP E. THALLNER GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Publication number: 20170047203Abstract: A device for bombarding at least one substrate with a plasma with a first electrode fiend a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.Type: ApplicationFiled: May 9, 2014Publication date: February 16, 2017Applicant: EV Group E. Thallner GmbHInventors: Thomas Glinsner, Christoph Flotgen, Johann Bernauer, Thomas Wagenleitner, Thomas Wieser, Florian Schmid, Thomas Plach, Roman Anzengruber, Alexander Nones, Uwe Kriebisch
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Publication number: 20160225625Abstract: A device and method for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate with the following features: a workspace that can be closed, gas-tight, against the environment and can be supplied with a vacuum, the workspace comprises: a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.Type: ApplicationFiled: September 25, 2013Publication date: August 4, 2016Applicant: EV GROUP E. THALLNER GMBHInventors: Markus WIMPLINGER, Viorel DRAGOI, Christoph FLOTGEN
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Publication number: 20160111394Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: December 21, 2015Publication date: April 21, 2016Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Patent number: 9252042Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: January 25, 2011Date of Patent: February 2, 2016Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 9159717Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence: forming a reservoir in a reservoir formation layer on the first contact surface, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, thinning of the second substrate and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with the second educt contained in the reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: October 13, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20150165752Abstract: A method for bonding of a first contact area of a first substrate to a second contact area of a second substrate, the second substrate having a least one reaction layer, and a device for carrying out said method. The method comprises: (a) accommodating the substrates between a first electrode and a second electrode, or within a coil, (b) formation of a reservoir on the first contact area by exposing the first contact area to a plasma (c) at least partially filling of the reservoir with a first educt or a first group of educts, (d) contacting the first contact area with the second contact area for formation of a pre-bond interconnection, (e) forming a permanent bond between the first and second contact areas at least partially strengthened by the reaction of the first educt with a second educt which is contained in the reaction layer of the second substrate.Type: ApplicationFiled: July 24, 2012Publication date: June 18, 2015Applicant: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 8975158Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: GrantFiled: April 8, 2011Date of Patent: March 10, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140073112Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: ApplicationFiled: April 8, 2011Publication date: March 13, 2014Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen