Abstract: A method and a device for monitoring a plurality of parallel-connected semiconductor switches. The method includes subjecting the plurality of semiconductor switches to a heating pulse, in which a predefined load current flows for a predefined period of time in order to achieve a predefined temperature change of the semiconductor switches, a variable of a semiconductor switch to be monitored from the plurality of semiconductor switches being detected both before and after the application of the heating pulse, and a state of the semiconductor switch to be monitored and/or an electronics packaging, which corresponds to the semiconductor switch to be monitored, being ascertained on the basis of a deviation of the change of the at least one variable from a predefined reference value. The method enables a measurement of individual semiconductor switches to be monitored from the plurality of semiconductor switches.

Abstract: An integrated circuit is described. The integrated circuit may comprise a multitude of floating-gate electrodes, wherein at least one of the floating-gate electrodes has a lower width and an upper width, the lower width being larger than the upper width, and wherein the at least one of the floating-gate electrodes comprises a transition metal. A corresponding manufacturing method for an integrated circuit is also described.

Abstract: In an embodiment, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include a plurality of multiple bit information storing memory cells, a plurality of buffer circuits, each buffer circuit being coupled to at least one multiple bit information storing memory cell of the plurality of multiple bit information storing memory cells, and a controller configured to control an access operation to access at least one multiple bit information storing memory cell using the buffer circuit coupled to the at least one multiple bit information storing memory cell to be accessed, and a buffer circuit of at least one other multiple bit information storing memory cell being coupled to at least one other multiple bit information storing memory cell.

Abstract: An integrated circuit is described. The integrated circuit may have: an active area line formed of a material of a semiconductor substrate with a first longitudinal direction parallel to an upper surface of the semiconductor substrate; wherein the active area line has at least one form-supporting element extending in a second longitudinal direction parallel to the upper surface of the semiconductor substrate; and wherein the second longitudinal direction is arranged with regard to the first longitudinal direction in an angle unequal to 0 degree and unequal to 180 degree.

Abstract: A method for forming trenches on a surface of a semiconductor substrate is described. The method may include: etching a first plurality of trenches into the surface of the semiconductor substrate; filling the first plurality of trenches with at least one material; and etching a second plurality of trenches into every second trench of the first plurality of trenches. Furthermore, a method for forming floating-gate electrodes on a semiconductor substrate and an integrated circuit is described.

Abstract: An integrated circuit is described. The integrated circuit may have: an active area line formed of a material of a semiconductor substrate with a first longitudinal direction parallel to an upper surface of the semiconductor substrate; wherein the active area line has at least one form-supporting element extending in a second longitudinal direction parallel to the upper surface of the semiconductor substrate; and wherein the second longitudinal direction is arranged with regard to the first longitudinal direction in an angle unequal to 0 degree and unequal to 180 degree.

Abstract: Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.

Abstract: In an embodiment, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include a plurality of multiple bit information storing memory cells, a plurality of buffer circuits, each buffer circuit being coupled to at least one multiple bit information storing memory cell of the plurality of multiple bit information storing memory cells, and a controller configured to control an access operation to access at least one multiple bit information storing memory cell using the buffer circuit coupled to the at least one multiple bit information storing memory cell to be accessed, and a buffer circuit of at least one other multiple bit information storing memory cell being coupled to at least one other multiple bit information storing memory cell.

Abstract: A method for forming trenches on a surface of a semiconductor substrate is described. The method may include: etching a first plurality of trenches into the surface of the semiconductor substrate; filling the first plurality of trenches with at least one material; and etching a second plurality of trenches into every second trench of the first plurality of trenches. Furthermore, a method for forming floating-gate electrodes on a semiconductor substrate and an integrated circuit is described.

Abstract: An integrated circuit is described. The integrated circuit may comprise a multitude of floating-gate electrodes, wherein at least one of the floating-gate electrodes has a lower width and an upper width, the lower width being larger than the upper width, and wherein the at least one of the floating-gate electrodes comprises a transition metal. A corresponding manufacturing method for an integrated circuit is also described.

Abstract: Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.