Abstract: The invention relates to an injection moulding machine having: an electric machine; multiple switching units electrically connected in parallel, wherein each switching unit has at least one electrical output and at least one electrical switch associated with the output, wherein corresponding outputs of the switching units are electrically connected in parallel with a common output; at least one primary open-loop and/or closed-loop controller which is designed to control the switching units with control signals in order to operate the electric machine; a measuring device for measuring output currents at the outputs; and at least one correction controller which is designed to adjust a corresponding control signal in the event of a deviation between a measured output current at an output and a target value.

Abstract: In a method for increasing the electrical functionality, and/or service life, of power electronic modules, the power electronic circuit carrier, and/or the metallisation applied onto the power electronic circuit carrier, and/or a base plate connected, or to be connected, to a rear face of the power electronic circuit carrier, is finely structured by means of local material removal with at least one laser beam, so as to reduce thermomechanical stresses occurring during the production or operation of the module. In an alternative form of embodiment, the metallisation applied onto the front face of the power electronic circuit carrier is structured, or an already created structure is refined or supplemented, by means of local material removal with laser radiation, so as to achieve a prescribed electrical functionality of the metallisation.

Abstract: The invention relates to a battery box for accommodating at least one battery for an electric vehicle, having an outer circumferential frame and a base. Below the frame, a circumferential frame reinforcing element is arranged for reinforcing the frame, wherein the material thickness of the frame reinforcing element corresponds to its cross-sectional height.

Abstract: In a method for increasing the electrical functionality, and/or service life, of power electronic modules, the power electronic circuit carrier, and/or the metallisation applied onto the power electronic circuit carrier, and/or a base plate connected, or to be connected, to a rear face of the power electronic circuit carrier, is finely structured by means of local material removal with at least one laser beam, so as to reduce thermomechanical stresses occurring during the production or operation of the module. In an alternative form of embodiment, the metallisation applied onto the front face of the power electronic circuit carrier is structured, or an already created structure is refined or supplemented, by means of local material removal with laser radiation, so as to achieve a prescribed electrical functionality of the metallisation.

Abstract: In a method for connecting components during production of power electronics modules or assemblies, surfaces of the components have a metallic surface layer upon supply, or are furnished therewith, wherein the layer has a surface that is smooth enough to allow direct bonding or is smoothed to obtain a surface that is smooth enough to allow direct bonding. The surface layers of the surfaces that are to be connected are then pressed against each other with a pressure of at least 5 MPa at elevated temperature, so that they are joined to each other, forming a single layer. The method enables simple, rapid connection of even relatively large contact surfaces, which satisfies the high requirements of power electronics modules.

Abstract: A pathology distribution system 10 is provided for automated sample container 14, 15 distribution. The system 10 comprises a loading station 500 for loading samples in primary containers 14 of different types, a sample handling station 16 for receiving the containers 14 and identifying the container types and samples therein, and a container distribution station 38 for distributing the containers in areas or racks in the distribution station 38 marked for analyzing processes prescribed for the samples therein.

Abstract: A pathology distribution system 10 is provided for automated sample container 14, 15 distribution. The system 10 comprises a loading station 500 for loading samples in primary containers 14 of different types, a sample handling station 16 for receiving the containers 14 and identifying the container types and samples therein, and a container distribution station 38 for distributing the containers in areas or racks in the distribution station 38 marked for analyzing processes prescribed for the samples therein.

Abstract: Layers are patterned with a lithography method during the fabrication of integrated circuits. A mask, which may be reflective or transmissive, for carrying out the method. The photosensitive layers are exposed to radiation that is emitted by a radiation source. The radiation lies in the extreme ultraviolet region and is guided via the mask onto the photosensitive layers.

Abstract: A pathology distribution system 10 is provided for automated sample container 14, 15 distribution. The system 10 comprises a loading station 500 for loading samples in primary containers 14 of different types, a sample handling station 16 for receiving the containers 14 and identifying the container types and samples therein, and a container distribution station 38 for distributing the containers in areas or racks in the distribution station 38 marked for analyzing processes prescribed for the samples therein.

Abstract: An alternating phase mask having a branched structure containing two opaque segments is described. Two transparent surface segments are disposed on both sides of the segments or the components thereof, respectively. The surface segments are provided with phases that are displaced by 180°±&Dgr; &agr;, whereby &Dgr; &agr; a is not more than 25°. The surface segments are separated by at least one transparent surface boundary segment whose phase is situated between the phases of the adjacent surface segments.

Abstract: The invention relates to a phase shift mask for lithographically producing small structures at the limit of a resolution that is predetermined by the wavelength of the exposure radiation. The phase shift mask has first regions A and second regions B that effect a phase-shift relative to the first regions. The second regions are arranged beside the first regions for producing a sudden phase shift along the boundaries between the first and the second regions. Individual first regions touch one another via corners at points, at which the second regions also touch one another via corners. The result is that the boundaries between first and second regions merge at these points and these points are opaque to the radiation. The invention makes it possible to expose extremely small contact holes with just a single exposure and thus leads to a reduction of costs in the fabrication of integrated semiconductor circuits.

Abstract: A method for generating mask layout data for lithography simulation includes prescribing original data defining an original layout of a mask and determining a deviation between the original layout and a subsequent layout of a mask derived from said original layout. On the basis of this deviation, new data defining a new layout is calculated. This new layout is more similar to the subsequent layout that it is to the original layout.

Abstract: A pathology distribution system 10 is provided for automated sample container 14, 15 distribution. The system 10 comprises a loading station 500 for loading samples in primary containers 14 of different types, a sample handling station 16 for receiving the containers 14 and identifying the container types and samples therein, and a container distribution station 38 for distributing the containers in areas or racks in the distribution station 38 marked for analyzing processes prescribed for the samples therein.

Abstract: An alternating phase mask having a branched structure containing two opaque segments is described. Two transparent surface segments are disposed on both sides of the segments or the components thereof, respectively. The surface segments are provided with phases that are displaced by 180° ±&Dgr; &agr;, whereby &Dgr; &agr; a is not more than 25°. The surface segments are separated by at least one transparent surface boundary segment whose phase is situated between the phases of the adjacent surface segments.

Abstract: For lithographically producing the smallest structures at less than the exposure wavelengths in semiconductor fabrication, a double exposure is carried out using a thick phase mask and a trimming mask, the trimming mask further structures the phase-contrast lines produced by the phase mask. Besides transparent or opaque regions, the trimming mask also has phase-shifting regions. These surround transparent regions of the trimming mask through which the phase-contrast lines produced by the first mask are locally re-exposed, that is to say interrupted. The intensity profile of successive line sections is especially rich in contrast through the addition of the phase-shifting partially transparent regions on the second mask; the distances between the line sections can be reduced. The trimming mask, otherwise used only for larger structures, is therefore suitable for the configuration of the finest dimensionally critical structures.

Abstract: A method for generating mask layout data for lithography simulation includes prescribing original data defining an original layout of a mask and determining a deviation between the original layout and a subsequent layout of a mask derived from said original layout. On the basis of this deviation, new data defining a new layout is calculated. This new layout is more similar to the subsequent layout that it is to the original layout.

Abstract: Layers are patterned with a lithography method during the fabrication of integrated circuits. A mask, which may be reflective or transmissive, for carrying out the method. The photosensitive layers are exposed to radiation that is emitted by a radiation source. The radiation lies in the extreme ultraviolet region and is guided via the mask onto the photosensitive layers.