Abstract: A detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit is presented. The base comprises an electrically insulating elastic mat in which a large quantity of fine electrically conductive wires, placed at a short distance from one another, are incorporated. The elastic mat is held between the first electric component and the second electric component. The base also includes means for selectively pressing the second electric component against the electrically insulating elastic mat so as to establish an electric contact between the electric components over the elastic mat.

Abstract: Detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit and comprising a support (7) traversed by openings (13). A metal pin (3) is inserted in each of the openings (13). One end of each pin is intended to be placed in electrical contact with at least one path (8) of the printed circuit, while the other end is intended to be placed in electrical contact with a connection finger (6) of the electric component mounted (1) or of the other printed circuit. The pins are held longitudinally only loosely within the openings (13), between two springs (4 and 40) permitting the pins to move slightly. The pins may be composed of a rod (3) or of a spring (3′). The springs (4 and 40) may be replaced by a rubber mat containing parallel electric wires. A radiator (35) holds the integrated circuit on the base.