Abstract: The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

Abstract: The disclosure relates to a manufacturing line for soldered components on a circuit board, comprising a soldering oven including at least two temperature zones having a predetermined temperature profile, a transport apparatus embodied to transport circuit boards through the temperature zones, and a control system, wherein, in at least one of the temperature zones, at least two heating elements are arranged such that a to-be-soldered surface of each circuit board is heated by the heating elements, wherein, in at least one of the temperature zones, at least two air circulators are arranged in the transport direction offset from one another and facing the surface to be soldered, and wherein the control system is configured to control the heating elements and the air circulators such that the to-be-soldered surface of the circuit board is heated according to the predetermined temperature profile.

Abstract: A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 ?m.

Abstract: A method for repairing a circuit board having at least one defective component, wherein the defective component is connected via at least one circuit board side, contact location mechanically and/or electrically with the circuit board including: removing the defective component from the circuit board cleaning the at least one circuit board side, contact location; applying a solder paste on the at least one cleaned circuit board side, contact location by means of a solder application stamp, wherein the solder application stamp first in a wetting step is brought at least partially into a reservoir with solder paste for wetting with the solder paste and then the wetted solder application stamp in a transfer step is brought onto the at least one desired circuit board side, contact location, so that solder paste is applied on the at least one circuit board side, contact location; populating the circuit board with a substitute component previously provided for the defective component; and soldering the substitute c