Patents by Inventor Christoph Kamseder

Christoph Kamseder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Separation of workpiece with three material removal stages
    Patent number: 10403506
    Abstract: A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.
    Type: Grant
    Filed: January 7, 2018
    Date of Patent: September 3, 2019
    Assignee: Infineon Technologies AG
    Inventors: Christoph Kamseder, Franco Mariani, Andreas Bauer, Thomas Fischer
  • Separation of workpiece with three material removal stages
    Publication number: 20190214299
    Abstract: A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.
    Type: Application
    Filed: January 7, 2018
    Publication date: July 11, 2019
    Inventors: Christoph Kamseder, Franco Mariani, Andreas Bauer, Thomas Fischer