Patents by Inventor Christoph Koller
Christoph Koller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11944796Abstract: A data collection device comprises: a first portion having one or more features configured for attaching of the first portion to a dosage knob of an injection device; a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion; a sensor arrangement configured to detect rotation of the first portion relative to the second portion; and a processor arrangement configured to, based on said detected movement, determine a medicament amount expelled by the injection device, wherein the coupling arrangement is configured to provide a non-permanent coupling between the first portion and the dosage knob of the injection device.Type: GrantFiled: August 24, 2020Date of Patent: April 2, 2024Assignee: Sanofi-Aventis Deutschland GMBHInventors: Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel, Stephan Riedel, Armin Koller, Alexander Heinrich, Florian Eberli, Philipp Muller, Sven Zwicker
-
Publication number: 20240100465Abstract: A filter device including at least one filter element adapted to filter a raw fluid and having a raw fluid side and a clean fluid side, the filter element having a clean fluid outlet arranged on the clean fluid side and extending in a first plane, at least one clean fluid collecting channel into which the clean fluid outlet opens; at least one compressed-air cleaning-off device adapted to generate a pressure pulse for cleaning-off foreign matter adhering to the filter element and to conduct the same through the clean fluid outlet to the filter element, wherein the compressed-air cleaning-off device is adapted to conduct the pressure pulse at least approximately along the first plane to the clean fluid outlet, wherein the compressed-air cleaning-off device comprises a compressed-air supply channel operationally coupled to a clean fluid collecting channel outlet and adapted to charge the clean fluid collecting channel with pressure pulses.Type: ApplicationFiled: October 13, 2020Publication date: March 28, 2024Applicant: Herding GmbH FiltertechnikInventors: Walter Herding, Urs Herding, Egid Koller, Dino Bethke, Stefan Hajek, Christoph Weih
-
Publication number: 20240066234Abstract: A data collection device comprises: a first portion having one or more features configured for attaching of the first portion to a dosage knob of an injection device; a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion; a sensor arrangement configured to detect rotation of the first portion relative to the second portion; and a processor arrangement configured to, based on said detected movement, determine a medicament amount expelled by the injection device, wherein the coupling arrangement is configured to provide a non-permanent coupling between the first portion and the dosage knob of the injection device.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel, Stephan Riedel, Armin Koller, Alexander Heinrich, Florian Eberli, Philipp Muller, Sven Zwicker
-
Publication number: 20240030677Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.Type: ApplicationFiled: July 20, 2023Publication date: January 25, 2024Inventors: Jörg Erich Sorg, Frank Singer, Christoph Koller
-
Patent number: 11749959Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.Type: GrantFiled: July 15, 2019Date of Patent: September 5, 2023Assignee: OSRAM OLED GMBHInventors: Jörg Erich Sorg, Frank Singer, Christoph Koller
-
Publication number: 20220186911Abstract: An optical device comprising at least one lamp is disclosed. The lamp comprises an output face for the light, and an image mask is mounted on said output face.Type: ApplicationFiled: March 16, 2020Publication date: June 16, 2022Inventors: Michael Koller, Richard Scheicher, Thomas Huettmayer, Christoph Koller, Julia Hoffmann, Christian Gammer, Sergey Khrushchev
-
Patent number: 11316075Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6).Type: GrantFiled: October 8, 2018Date of Patent: April 26, 2022Assignee: OSRAM OLED GMBHInventors: Jörg Erich Sorg, Christoph Koller, Andreas Dobner
-
Publication number: 20210281041Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.Type: ApplicationFiled: July 15, 2019Publication date: September 9, 2021Inventors: Jörg Erich Sorg, Frank Singer, Christoph Koller
-
Publication number: 20200303594Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6).Type: ApplicationFiled: October 8, 2018Publication date: September 24, 2020Inventors: Jörg Erich SORG, Christoph KOLLER, Andreas DOBNER
-
Patent number: 10468317Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protType: GrantFiled: July 27, 2018Date of Patent: November 5, 2019Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Thomas Schwarz, Stefan Groetsch, Joerg Erich Sorg, Christoph Koller
-
Publication number: 20190051788Abstract: A light source is disclosed. In an embodiment a light source includes at least one first semiconductor emitter for generating first light, at least one second semiconductor emitter for generating second light, the second light having a different color than the first light, a light mixing body configured to produce a mixed light from the first and second lights and a detector on the light mixing body, the detector configured to determine a color locus of the mixed light, wherein the first and second semiconductor emitters are arranged along a line and have different distances from the detector, wherein the light mixing body is arranged on side surfaces of the first and second semiconductor emitters and in projection onto the side surfaces at least partially covers each of the side surfaces, so that the detector receives light from each of the first and second semiconductor emitters through the light mixing body.Type: ApplicationFiled: May 29, 2017Publication date: February 14, 2019Inventors: Frank Singer, Alexander Linkov, Stefan Illek, Rainer Butendeich, Christoph Koller, Thomas Schwarz
-
Publication number: 20190035702Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protType: ApplicationFiled: July 27, 2018Publication date: January 31, 2019Inventors: Thomas SCHWARZ, Stefan GROETSCH, Joerg Erich SORG, Christoph KOLLER
-
Publication number: 20160276545Abstract: In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially curing the adhesive layer applied to the carrier, providing a chip, wherein the chip has a substrate and a layer sequence arranged on the substrate, laying the chip onto the initially cured adhesive layer by way of a top side of the layer sequence, embedding the chip into a shaped body, wherein the top side of the layer sequence and a first side of the shaped body lie substantially in a plane, separating the embedded chip from the adhesive layer and the carrier, and applying an electrically conductive structure to the first side of the shaped body, the shaped body forming a vertical electrical insulation between the electrically conductive structure and the substrate.Type: ApplicationFiled: October 16, 2014Publication date: September 22, 2016Inventors: Johannes Mueller, Christoph Koller, Thomas Schwarz, Frank Singer