Abstract: In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

Abstract: The disclosure relates to a power module including a semiconductor component configured to be contacted on the top side and the underside. The semiconductor component is configured to be electrically contacted on the top side by a leadframe matrix by contact pressure.

Abstract: The invention relates to a regulating device (1) for a motor, comprising a housing (2) which can be associated with said motor and in which a control unit (5) and an actuator (6) are arranged. Due to heat-related reasons, said device can only be used in an encapsulated manner, for example close to a motor. In order to solve this problem, the actuator (6) comprises an electromagnetic switching element (8a,8b) and the control signal (7) for the same is designed as a timing signal which is measured—taking into consideration at least one heat source inside or optionally outside the housing (2)—in such a way that the operating temperature of the electromagnetic switching element (8a,8b) is below an upper authorised limiting value.