Abstract: The invention relates to a method of operating a machine system (1) comprising a plurality of machines (2). Said machines (2) are in particular machine tool devices with numerical control, NC, or programmable logic controller, PLC, control systems and are connected to a computing system (3) of the machine system (1). The machine system (1) further comprises human-machine-interfaces (8; 9; 10; 11) to present machine (2) information and at least one operator detection unit (6; 7). Said operator detection unit (6; 7) detects a machine operator (4) being in the proximity of a machine (2) and/or walking past a machine (2) and collects operator behavior data (5). The operator detection unit (6; 7) sends the collected operator behavior data (5) to the computing system (3) which selects information to be presented to the machine operator (4) in dependence on the operator behavior data (5) and selects at least one of the human-machine-interfaces (8; 9; 10; 11) to present said information.

Abstract: A method of operating a machine for a production facility, in particular a machine tool. According to the method, at least one machine condition signal; characterizing an operating condition of the machine is obtained and at least one audio signal representing the at least one machine condition signal is generated. The at least one audio signal is presented to an operator operating the machine. Further, at least one relative position in space is assigned to the at least one audio signal and the at least one audio signal is presented to the operator such that it is deemed to emerge from the relative position in space assigned to the audio signal.

Abstract: A method of operating a production system that includes a job optimization unit and at least two machines, wherein each machine is allocated to a process optimization unit. The job optimization unit receives a job request and broadcasts a manufacturing request based on the job request to some or all of the process optimization units. The process optimization units analyze the manufacturing request based on the current status of the machine, processes allocated to the machine and resources needed to complete at least a part of the manufacturing request and report to the job optimization unit which parts of the manufacturing request they can produce along with production parameters. The job optimization unit collects the reports, generates an optimized production plan, and broadcasts a manufacturing plan which is based on the production plan to the process optimization units. The machines produce products according to the manufacturing plan.

Abstract: The present invention relates to a processing module for a building panel and a method for processing a building panel. The processing module for a building panel comprises an input station and a manoeuvring station. The input station comprises a reception for a building panel and the building panel bundles several individual building elements. The manoeuvring station comprises a swiveling device for transporting and swiveling the building panel.

Abstract: The invention relates to a device (15) and a method (V) for machining a tool (16) by removing material. The tool (16) is first of all measured in three dimensions using a measuring unit (17) and a three-dimensional virtual tool model (M) is produced therefrom. This virtual tool model (M) is compared with a reference contour (R) from a particular tool data record (WD). If a match was determined, a machining program (PR) assigned to the tool data record (WD) is selected and a desired contour (SK) is determined by fitting the reference contour (R) into the three-dimensional virtual tool model (M). The tool (16) can then be machined on the basis of this desired contour (SK).

Abstract: The invention relates to a device (15) and a method (V) for machining a tool (16) by removing material. The tool is first of all measured in three dimensions using a measuring unit (17) and a three-dimensional virtual tool model (M) is produced therefrom. This virtual tool model (M) is compared with a reference contour (R) from a particular tool data record (WD). If a match was determined, a machining program (PR) assigned to the tool data record (WD) is selected and a desired contour (SK) is determined by fitting the reference contour (R) into the three-dimensional virtual tool model (M). The tool (16) can then be machined on the basis of this desired contour (SK).

Abstract: The invention relates to a method and a laser machining device 10 for machining a workpiece 13. The laser machining device 10 has a laser 11 for generating a laser beam 12, which is deflected by way of a deflecting device 15 in accordance with a pattern defined by a control unit 14 and is directed onto a workpiece surface 17 of a workpiece 13, which surface is to be machined. The point of impingement 18 of the deflected laser beam 12b on the workpiece surface 17 is guided along at least one spiral path within a circular hatched area 16. The spiral path 19 is characterized by spiral path parameters. One spiral path parameter is the line spacing a between neighboring points of intersection P of the spiral path 19 with an axis running through the center point M of the spiral path 19.

Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).

Abstract: The invention relates to a method and a laser machining device 10 for machining a workpiece 13. The laser machining device 10 has a laser 11 for generating a laser beam 12, which is deflected by way of a deflecting device 15 in accordance with a pattern defined by a control unit 14 and is directed onto a workpiece surface 17 of a workpiece 13, which surface is to be machined. The point of impingement 18 of the deflected laser beam 12b on the workpiece surface 17 is guided along at least one spiral path within a circular hatched area 16. The spiral path 19 is characterized by spiral path parameters. One spiral path parameter is the line spacing a between neighboring points of intersection P of the spiral path 19 with an axis running through the center point M of the spiral path 19.

Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).

Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: Embodiments of a differential thermal expansion bonding device are described for the high volume bonding of laminae together to form a MECS device. One embodiment of the device comprises a frame, engager made of a solid, liquid or gas, preload with springs and platens. Other embodiments of a method for bonding laminae together to form a MECS device using surface mount technology (SMT) techniques are described, with one embodiment being directed towards conveyorized bonding. The method including providing laminae to be bonded that do not include a solder mask, microething at least a portion of at least one lamina, applying solder paste to a microetched portion, and bonding the laminae together using the solder paste. A method for continuously bonding laminae also is described, such as by using a conveyorized furnace for applying heat to a workpiece functionally associated with the bonding device. The method can include forced convective heating, cooling or both, using inert gas flush.