Abstract: A power unit for an electrical steering system includes a motor housing for accommodating a motor, a heat sink and a drive electronics system, which is arranged on the heat sink, for the motor. The heat sink and the motor housing are connected to one another in such a way that heat exchange from the drive electronics system, via the heat sink, to the motor housing is possible. The heat sink is at least partially connected to the motor housing by calking or welding or screwing. A method is used for assembling a power unit having a motor housing for accommodating a motor, a heat sink and a drive electronics system, which is arranged on the heat sink, for the motor. A connection is established between the heat sink and the motor housing by calking or welding or screwing.

Abstract: A power unit for an electrical steering system comprises a motor housing for accommodating a motor, a heat sink and a drive electronics system, which is arranged on the heat sink, for the motor. The heat sink and the motor housing are connected to one another in such a way that heat exchange from the drive electronics system, via the heat sink, to the motor housing is possible. The heat sink is at least partially connected to the motor housing by calking or welding or screwing. A method is used for assembling a power unit having a motor housing for accommodating a motor, a heat sink and a drive electronics system, which is arranged on the heat sink, for the motor. A connection is established between the heat sink and the motor housing by calking or welding or screwing.

Abstract: A drive device having an electric motor and an electronic control system for the electric motor, the electronic control system being disposed on a circuit carrier. Provision is made that the circuit carrier is a mechanical component, or part of a mechanical component, of the electric motor.

Abstract: The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.

Abstract: An exhaust heat exchanger for an exhaust gas recirculation system, including a first flow path for the intake air for an internal combustion engine, a second flow path for the exhaust of an internal combustion engine, and a housing enclosing the first and second flow paths. The first and second flow paths are each divided into a plurality of flow channels in heat-conducting, metallically connected contact with each other, and the flow channels include elements promoting heat exchange between the flow channels.

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: A heat exchanger including flat tubes having cooling passages for a gas and a bypass for the gas separate from the cooling passages, and coolant channels defined between every two flat tubes adjacent the tube passages and spaced from the bypass of the tubes. The tubes define a cooled area adjacent the passages and an uncooled area adjacent the bypass substantially spaced from the channels.

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A heat exchanger including flat tubes having cooling passages for a gas and a bypass for the gas separate from the cooling passages, and coolant channels defined between every two flat tubes adjacent the tube passages and spaced from the bypass of the tubes. The tubes define a cooled area adjacent the passages and an uncooled area adjacent the bypass substantially spaced from the channels.

Abstract: An exhaust heat exchanger for an exhaust gas recirculation system, including a first flow path for the intake air for an internal combustion engine, a second flow path for the exhaust of an internal combustion engine, and a housing enclosing the first and second flow paths. The first and second flow paths are each divided into a plurality of flow channels in heat-conducting, metallically connected contact with each other, and the flow channels include elements promoting heat exchange between the flow channels.

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A power converter having at least two semiconductor substrates is provided. Each of the substrates has at least two contact surfaces, and the converter also has two thermally conductive mounting plates carrying the semiconductor substrates, which each have an electrical terminal, an attachment arrangement implemented on one of the mounting plates, and having at least one third electrical terminal, which is distinguished in that the mounting plates and the semiconductor substrates form stacks, the mounting plates receiving the semiconductor substrates between themselves, and an electrically and thermally conductive insert, which has at least the third terminal, is arranged between the semiconductor substrates.

Abstract: An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate. Using the assembly device, the two circuit substrates may be simply adjusted with respect to each other during assembly of the electronic component. For this, the assembly device includes a first lower shell including an accommodation for the first of the two circuit substrates, an arrangement for the defined alignment of the first circuit substrate in the accommodation, and a second, upper shell including an arrangement for adjusting the second circuit substrate positioned on the semiconductor element. A method for assembling an electronic component in sandwich type of construction, using such an assembly device, is also described.

Abstract: Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Abstract: A power converter (1) is described having at least two semiconductor substrates (15), each of which has at least two contact surfaces (16, 17), two thermally conductive mounting plates (11, 12), carrying the semiconductor substrates (15), which each have an electrical terminal (B+, B−), an attachment means (22) implemented on one of the mounting plates (11, 12), and having at least one third electrical terminal (U, V, W), which is distinguished in that the mounting plates (11, 12) and the semiconductor substrates (15) form stacks (20), the mounting plates (11, 12) receive the semiconductor substrates (15) between themselves, and an electrically and thermally conductive insert (18), which has at least the third terminal (U, V, W), is arranged between the semiconductor substrates (15).

Abstract: An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate. Using the assembly device, the two circuit substrates may be simply adjusted with respect to each other during assembly of the electronic component. For this, the assembly device includes a first lower shell including an accommodation for the first of the two circuit substrates, an arrangement for the defined alignment of the first circuit substrate in the accommodation, and a second, upper shell including an arrangement for adjusting the second circuit substrate positioned on the semiconductor element. A method for assembling an electronic component in sandwich type of construction, using such an assembly device, is also described.