Abstract: The invention relates to a method for encapsulating an element with a body of plastic. The element is placed into a cavity in an injection mold and fixed therein by means of a movable retaining pin. Then the plastic is injected into the cavity. Subsequently, the retaining pin is moved away from the element after filling of the cavity and while the plastic is still in a plastic state so that plastic can subsequently flow into the volume vacated by the retaining pin, to produce a kind of weld line in the region of the fixing on the body. Then, the retaining pin is moved back in the direction of the element while the plastic that subsequently flowed into the volume is still in a plastic state so that a kind of compression of the plastic takes place in the region of the fixing on the body.

Abstract: The invention relates to a method for encapsulating an element with a body of plastic. The element is placed into a cavity in an injection mold and fixed therein by means of a movable retaining pin. Then the plastic is injected into the cavity. Subsequently, the retaining pin is moved away from the element after filling of the cavity and while the plastic is still in a plastic state so that plastic can subsequently flow into the volume vacated by the retaining pin, to produce a kind of weld line in the region of the fixing on the body. Then, the retaining pin is moved back in the direction of the element while the plastic that subsequently flowed into the volume is still in a plastic state so that a kind of compression of the plastic takes place in the region of the fixing on the body.