Patents by Inventor Christoph Tschudin

Christoph Tschudin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for dispensing solder on a substrate
    Patent number: 6811074
    Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: November 2, 2004
    Assignee: ESEC Trading SA
    Inventors: Guido Suter, Christoph Tschudin
  • Unleaded solder
    Publication number: 20040170524
    Abstract: The invention concerns a lead-free solder comprising a bismuth-based alloy. The lead-free solder has a proportion of at least 80 percent by weight of bismuth and a solidus temperature of at least 260° C.
    Type: Application
    Filed: December 12, 2003
    Publication date: September 2, 2004
    Inventors: Petra Lambracht, Markus Rettenmayr, Christoph Tschudin, Souad Arsalane
  • Method and apparatus for dispensing solder on a substrate
    Publication number: 20030168498
    Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.
    Type: Application
    Filed: February 27, 2003
    Publication date: September 11, 2003
    Applicant: ESEC Trading SA, a Swiss Corporation
    Inventors: Guido Suter, Christoph Tschudin