Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

Abstract: A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A coil arrangement has an electrical coil and an armature movable between a first and second end positions, an electronic switch switchable between at least two switch states, a control and monitoring circuit for producing a switching signal actuating the electronic switch and an operating circuit for providing an operating voltage and an electrical current measurement signal representing an electrical current flowing as a function of time in a coil electrical current circuit formed with the coil. The control and monitoring circuit is adapted to detect whether an inductance of the coil has a dependence on the switching signal as a function of time. The electromechanical has a first switch contact movable between first and second switch positions, a second switch contact and a coil arrangement of the invention, while the measurement transmitter has also a measuring circuit for receiving at least one transducer signal.

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

Abstract: A test system (1) for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board (6) to be tested, characterized in that the test system (1) includes a subassembly, which is movably mounted in a housing (1a) of the test system, and a current and/or voltage source (14) for energizing the circuit board (6) to be tested, the current and/or voltage source (14) being arranged in the housing (1a) of the test system (1) in such a way as to be movable in at least two directions in space.

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

Abstract: A coil arrangement comprises an electrical coil and an armature movable between a first end position (I) and a second end position, an electronic switch switchable between at least two switch states, a control and monitoring circuit for producing a switching signal actuating the electronic switch and an operating circuit for providing an operating voltage and an electrical current measurement signal representing an electrical current flowing as a function of time in a coil electrical current circuit formed with the coil. The control and monitoring circuit is additionally adapted using the electrical current measurement signal to perform a checking of the coil, for example, namely to detect, whether an inductance, of the coil has a dependence on the switching signal as a function of time, respectively a behavior as a function of time corresponding with the switching signal as a function of time.

Abstract: A circuit for signal transfer and galvanic isolation between first and second digital signal processing units, wherein a first signal path is provided between the first and second signal processing units. The first signal path has a first section, which includes positive and negative signal lines and serves for transfer of a differential signal between the first and second signal processing units. At least one capacitor is provided in the positive signal line and at least one capacitor in the negative signal line. The capacitors serve for galvanic isolation between the first signal processing unit and the second signal processing unit, and the capacitors are embodied, in each case, according to the specifications of the ignition protection type, intrinsic safety.