Abstract: The present invention relates to a set of security documents. Each security document within the set having an optical code, notably a barcode, which is neither connected nor coupled to any electronic chip that may be carried by the security document. The optical code on each security document within the set encodes the same information for the same optical reader. Each security document having different respective electromagnetic signature, these signatures being unique to each of the security documents.

Abstract: A method for authenticating a security element by superimposing N shared colour images in order to obtain at least one target colour may include a phase of constructing an authenticator system that includes a step of selecting a target colour; a step of selecting a series of N decomposition colours which, by means of superimposition, together enable the target colour to be obtained; and a step of recording the N shared images each with a decomposition colour from the series. A security element comprising at least one shared image may be obtained according to the method.

Abstract: The present invention relates to a set of security documents. Each security document within the set having an optical code, notably a barcode, which is neither connected nor coupled to any electronic chip that may be carried by the security document. The optical code on each security document within the set encodes the same information for the same optical reader. Each security document having different respective electromagnetic signature, these signatures being unique to each of the security documents.

Abstract: The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synt

Abstract: A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps: producing an antenna (12) having contacts (13 and 14) on a support (10), creating a recess (20) between the contacts (13 and 14), placing adhesive dielectric material (25, 26) near the contacts of the antenna, positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20), placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60), placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film, laminating all the layers.

Abstract: A method for connecting an electronic chip (10) to contacts (47and 48) of an electric circuit, the chip having two conductive plates (31and 32) located on the last layer of the chip and at least one electromagnetic shielding layer, at least one of the plates (31or 32) being entirely covered with an electrical insulating layer (34). The method includes placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), to fix the electronic chip (10) relative to the circuit, positioning electronic chip (10) on the circuit so that conductive plates (31et 32) are opposite the contacts (47and 48), so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31or 32), the electrically insulating layer and the contact (47or 48).

Abstract: A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract: A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract: The invention concerns a radio frequency identification device (RFID) featuring an antenna (12) screen-printed on a fibrous support and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to the main characteristic of the invention, a thermoplastic layer (22) and a layer of paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and so that the device is resistant to water and humid environments.

Abstract: A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps: producing an antenna (12) having contacts (13 and 14) on a support (10), creating a recess (20) between the contacts (13 and 14), placing adhesive dielectric material (25, 26) near the contacts of the antenna, positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20), placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60), placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film, laminating all the layers.

Abstract: The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synthet

Abstract: The invention concerns a method for connecting an electronic chip (10) to contacts (47 and 48) of an electric circuit and designed to receive the chip, the chip being provided with two conductive plates (31 and 32) located on the last layer making up the chip and at least one electromagnetic shielding layer, at least one of the plates (31 or 32) being entirely covered with an electrically insulating layer (34), the method including the following steps: Placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), so as to maintain the electronic chip (10) in a fixed position relative to the circuit, Positioning the electronic chip (10) on the circuit so that the conductive plates (31 et 32) are opposite the contacts (47 and 48) of the electric circuit, so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31 or 32), the electrically insulating layer completely covering said plate and the contact (47 or 48).

Abstract: A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.

Abstract: The invention concerns a radio frequency identification device (RFID) including a chip (12) and an antenna (10) connected together on a support, the antenna being printed onto the support and the support being fixed to an object with an added attachment means. According to the main characteristic, the attachment means overlaps at least once at least one turn of the antenna so that the radio frequency identification device (RFID) is destroyed if the support is detached from the object without the attachment means being removed.

Abstract: The invention concerns a radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract: A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract: A method for manufacturing a radiofrequency identification device which includes a manufacturing process for an antenna which includes screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting the support to heat treatment to bake and polymerize the conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination which includes making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, and removal of the transfer paper sheet.

Abstract: The invention concerns a method for extracting chips (20) from a silicon wafer (10) and for transferring each chip on an electronic device including the following steps: Extracting the good chips from the silicon wafer (10) and transferring them on a roll-up adhesive film (28) so that the chips are spaced out by a certain distance, Transferring the chips (20) from the roll-up film (28) directly and continuously on contacts (46, 48 or 58, 60) of the electronic device.

Abstract: A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.

Abstract: Method of manufacturing a contactless chip card including an antenna support (40) on which the antenna is screenprinted and an electronic module or a chip (50) connected to the two antenna terminals and at least two card bodies on either side of antenna support, the antenna bodies being thermoplastic sheets (62, 64, 66, and 68) applied by hot pressure lamination, the sheet of thermoplastic (62) which is applied onto the face of the antenna support (40) receiving electronic module or chip (50) is perforated with a through-cavity (56) and its thickness is greater than the thickness of electronic module or chip (50), said cavity (56) being situated such that said electronic module or chip (50) is inside the cavity when said sheet (62) is placed on said support (40) before lamination step and such that electronic module or chip (50) is not subjected to any pressure during the lamination step.