Abstract: A process for producing a component includes a structure made of III-V material(s) on the surface of a substrate, the structure comprising at least one upper contact level defined on the surface of a first III-V material and a lower contact level defined on the surface of a second III-V material, comprising: successive operations of encapsulation of the structure with at least one dielectric; making primary apertures in a dielectric for the two contacts; making secondary apertures in a dielectric for the two contacts; at least partial filling of the apertures with at least one metallic material so as to produce upper contact bottom metallization and at least one upper contact pad in contact with the metallization for each of said contacts. A component produced by the process is also provided. The component may be a laser diode.

Abstract: A process for producing a component includes a structure made of III-V material(s) on the surface of a substrate, the structure comprising at least one upper contact level defined on the surface of a first III-V material and a lower contact level defined on the surface of a second III-V material, comprising: successive operations of encapsulation of the structure with at least one dielectric; making primary apertures in a dielectric for the two contacts; making secondary apertures in a dielectric for the two contacts; at least partial filling of the apertures with at least one metallic material so as to produce upper contact bottom metallization and at least one upper contact pad in contact with the metallization for each of said contacts. A component produced by the process is also provided. The component may be a laser diode.

Abstract: A laser diode of the VC SEL type includes, superimposed on top of a substrate, a bottom Bragg mirror, a region of one or more quantum wells, and a top Bragg mirror. A section of the bottom Bragg mirror has an area that is less than that of a section of the top Bragg mirror, the sections being defined in planes parallel to the plane of the substrate. The laser diode further includes a peripheral region, constituted by a confinement material, situated between the substrate and the top Bragg mirror, and surrounding at least the bottom Bragg mirror. The laser diode is devoid of any laterally-oxidized layer. Thanks to the specific geometrical configuration of the laser diode, the charge carriers are confined, during operation, to the center of the laser diode.

Abstract: A photonic circuit including a structure of coupling to an external device, the structure including a main waveguide and at least two secondary waveguides, each secondary waveguide having a first portion substantially parallel to the main guide arranged in the vicinity of the main guide to perform an evanescent wave coupling between the main guide and the secondary guide, the first portion extending in a second portion having an end opposite to the first portion defining a coupling surface of the secondary guide, emerging at the level of an external surface of the circuit.

Abstract: A photonic circuit including a structure of coupling to an external device, the structure including a main waveguide and at least two secondary waveguides, each secondary waveguide having a first portion substantially parallel to the main guide arranged in the vicinity of the main guide to perform an evanescent wave coupling between the main guide and the secondary guide, the first portion extending in a second portion having an end opposite to the first portion defining a coupling surface of the secondary guide, emerging at the level of an external surface of the circuit.

Abstract: While performing plasma-enhanced chemical vapor deposition on a substrate by exposing the substrate in a vacuum to a flow of particles generated by a plasma, which particles react to form a passivation layer on the substrate, a grid is interposed between the plasma and the substrate, thereby reducing the flow of charged particles towards the substrate while conserving a flow of neutral particles. The grid is formed of metal wires that are crossed at a pitch that is less than two or three times the Debye length (?D) of the plasma used, at least at the beginning of deposition. The aging properties of semiconductor components made by such a method is thereby improved.

Abstract: According to the invention, while performing plasma-enhanced chemical vapor deposition on a substrate by exposing the substrate in a vacuum to a flow of particles generated by a plasma, which particles react to form a passivation layer on the substrate, a grid is interposed between the plasma and the substrate, thereby reducing the flow of charged particles towards the substrate while conserving a flow of neutral particles. The grid is formed of metal wires that are crossed at a pitch that is less than two or three times the Debye length (?D) of the plasma used, at least at the beginning of deposition. The aging properties of semiconductor components made by such a method is thereby improved.

Abstract: According to the invention, while performing plasma-enhanced chemical vapor deposition on a substrate by exposing the substrate in a vacuum to a flow of particles generated by a plasma, which particles react to form a passivation layer on the substrate, a grid is interposed between the plasma and the substrate, thereby reducing the flow of charged particles towards the substrate while conserving a flow of neutral particles. The grid is formed of metal wires that are crossed at a pitch that is less than two or three times the Debye length (?D) of the plasma used, at least at the beginning of deposition. The aging properties of semiconductor components made by such a method is thereby improved.