Abstract: The field of the invention is that of electronic apparatus cases and more particularly electronic apparatus cases with which carriers, especially aircraft, are equipped. The electronic apparatus case comprises metal walls (101), (102), (103), (104) that are mounted on reinforcements, the reinforcements comprising two frames (111), (112) and four cross-members (113), (114), (115), (116) of identical length connecting the two frames (111), (112). According to the invention, the frames (111), (112) are made of cast magnesium alloy, molded and/or machined, and in that at least one of the walls (101), (102), (103), (104) is made from a sheet of magnesium alloy.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.