Patents by Inventor Christophe Metivier

Christophe Metivier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pluggable optical module with heat sink
    Patent number: 10488608
    Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 26, 2019
    Assignee: Arista Networks, Inc.
    Inventors: Robert Wilcox, Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier
  • PLUGGABLE OPTICAL MODULE WITH HEAT SINK
    Publication number: 20180348457
    Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.
    Type: Application
    Filed: August 8, 2018
    Publication date: December 6, 2018
    Inventors: Robert Wilcox, Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier
  • Pluggable optical module with heat sink
    Patent number: 10073230
    Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 11, 2018
    Assignee: Arista Networks, Inc.
    Inventors: Robert Wilcox, Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier
  • Pluggable Optical Module with Heat Sink
    Publication number: 20170168253
    Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 15, 2017
    Applicant: Arista Networks, Inc.
    Inventors: Robert Wilcox, Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier
  • Form factor adapter module
    Patent number: 8165471
    Abstract: According to one example embodiment, a form factor adapter module may include a small form factor (SFF) host connector, an X2 or XENPAK edge finger connector, and a serial to XAUI transceiver. The SFF host connector may be configured receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serial Gigabit Media Independent Interface (SGMII) or Serializer-deserializer Framer Interface (SFI) protocol. The X2 or XENPAK edge finger connector may be configured to mate with an X2 or XENPAK edge finger socket and to transmit and receive data according to a Ten Gigabit Ethernet Attachment Unit Interface (XAUI) protocol. The serial to XAUI transceiver may be coupled to both the SFF host connector and the X2 or XENPAK edge finger connector. The serial to XAUI transceiver may be configured to convert data between the SGMII or SFI protocol and the XAUI protocol.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: April 24, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: James Thomas Theodoras, II, Christophe Metivier, Travis Legg
  • FORM FACTOR ADAPTER MODULE
    Publication number: 20090257754
    Abstract: Various example embodiments are disclosed. According to one example embodiment, a form factor adapter module may include a small form factor (SFF) host connector, an X2 or XENPAK edge finger connector, and a serial to XAUI transceiver. The SFF host connector may be configured receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serial Gigabit Media Independent Interface (SGMII) or Serializer-deserializer Framer Interface (SFI) protocol. The X2 or XENPAK edge finger connector may be configured to mate with an X2 or XENPAK edge finger socket and to transmit and receive data according to a Ten Gigabit Ethernet Attachment Unit Interface (XAUI) protocol. The serial to XAUI transceiver may be coupled to both the SFF host connector and the X2 or XENPAK edge finger connector. The serial to XAUI transceiver may be configured to convert data between the SGMII or SFI protocol and the XAUI protocol.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: James Thomas Theodoras, II, Christophe Metivier, Travis Legg
  • 10/100/1000/2500 Mbps serial media independent interface (SGMII)
    Patent number: 7356047
    Abstract: A SGMII that operates to transfer data between MAC and PHY chips at 2500/1000/100/10 Mbps utilizes a unique frame extending technique in one embodiment where frames having multiples of 2 and 3 data bytes are utilized to change the data transfer rate by multiples of 2.5. In another embodiment different clock signals are utilized.
    Type: Grant
    Filed: April 24, 2004
    Date of Patent: April 8, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Sanjeev Mahalawat, John McCool, Christophe Metivier, Sun-Den Chen