Abstract: A method for manufacturing electronic chips includes depositing, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, a protective resin. The method includes forming, in the protective resin, at least one cavity per integrated circuit, in contact with an upper face of the integrated circuit. Metal connection pillars are formed by filling the cavities with metal. The integrated circuits are separated into individual chips by cutting the protective resin along cut lines extending between the metal connection pillars.

Abstract: A method for manufacturing electronic chips includes depositing, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, a protective resin. The method includes forming, in the protective resin, at least one cavity per integrated circuit, in contact with an upper face of the integrated circuit. Metal connection pillars are formed by filling the cavities with metal. The integrated circuits are separated into individual chips by cutting the protective resin along cut lines extending between the metal connection pillars.

Abstract: A method for manufacturing electronic chips includes forming, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, trenches laterally separating the integrated circuits. At least one metal connection pillar per integrated circuit is deposited on the side of the upper face of the substrate, and a protective resin extends in the trenches and on an upper face of the integrated circuits. The method further includes forming, from an upper face of the protective resin, openings located across from the trenches and extending over a width greater than or equal to that of the trenches, so as to clear a flank of at least one metal pillar of each integrated circuit. The integrated circuits are separated into individual chips by cutting.

Abstract: A method for manufacturing electronic chips includes depositing, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, a protective resin. The method includes forming, in the protective resin, at least one cavity per integrated circuit, in contact with an upper face of the integrated circuit. Metal connection pillars are formed by filling the cavities with metal. The integrated circuits are separated into individual chips by cutting the protective resin along cut lines extending between the metal connection pillars.

Abstract: A method for manufacturing electronic chips includes forming, on a side of an upper face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed, trenches laterally separating the integrated circuits. At least one metal connection pillar per integrated circuit is deposited on the side of the upper face of the substrate, and a protective resin extends in the trenches and on an upper face of the integrated circuits. The method further includes forming, from an upper face of the protective resin, openings located across from the trenches and extending over a width greater than or equal to that of the trenches, so as to clear a flank of at least one metal pillar of each integrated circuit. The integrated circuits are separated into individual chips by cutting.

Abstract: This invention describes a device for the generation of electric energy from small movements which comprises: a magnet with the shape of a solid of revolution which comprises at least a couple of poles (N, S) placed around an axis of revolution; a tube whose transversal section is complementary to the shape of the magnet, and which comprises a winding rolled transversally around it, with the magnet placed in the interior of the tube so that an inclination of the tube causes the magnet to roll, traveling along the interior of the tube and inducing tension on the winding.

Abstract: A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 ?m and with its largest portion having a diameter ranging between 2 and 8 ?m, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 ?m.

Abstract: This invention describes a device for the generation of electric energy from small movements which comprises: a magnet with the shape of a solid of revolution which comprises at least a couple of poles (N, S) placed around an axis of revolution; a tube whose transversal section is complementary to the shape of the magnet, and which comprises a winding rolled transversally around it, with the magnet placed in the interior of the tube so that an inclination of the tube causes the magnet to roll, traveling along the interior of the tube and inducing tension on the winding.

Abstract: A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 ?m and with its largest portion having a diameter ranging between 2 and 8 ?m, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 ?m.

Abstract: A package for a fuel cell having an upper plate having a plurality of openings, the front surface of a cell element being intended to be received under each opening to close it, each cell element having a first pad and a second connection pad, each opening being provided with at least one crossbar connecting two sides of the opening, this crossbar having at least a conductive track portion having a first end connected to a pad of a first cell element and having a second end connected to a pad of a neighboring cell element.

Abstract: A package for a fuel cell having an upper plate having a plurality of openings, the front surface of a cell element being intended to be received under each opening to close it, each cell element having a first pad and a second connection pad, each opening being provided with at least one crossbar connecting two sides of the opening, this crossbar having at least a conductive track portion having a first end connected to a pad of a first cell element and having a second end connected to a pad of a neighboring cell element.