Abstract: The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.

Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.

Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.

Abstract: An elastic guided acoustic wave coupling resonator filter includes a dielectric layer interposed between piezoelectric substrates, with interdigital transducers on each substrate generally positioned at an interface between the substrates and the dielectric layer. The interdigital transducers on one substrate are aligned with the transducers on the opposing substrate and include cascaded filter tracks. The cascaded orientation between the two filter tracks includes either a differential connection or a balanced connection. As a result, the interdigital transducers are electrically isolated yet acoustically coupled to each other.

Abstract: Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed.

Abstract: A wafer level package is produced by forming a photo definable polymer into a frame structure around a device located on a device wafer while maintaining the polymer in a partially cured state. Additional polymer material is used form a cap structure on a carrier wafer. The cap structure is attached to the frame structure so as to place the device within a cavity, wherein sufficient pressure is applied to the cap structure to hold the frame structure via a bonding of the partially cured photo definable polymers. The bonding is characterized by adhesion strength greater than the adhesion strength securing the cap structure to the carrier wafer. The carrier wafer is separated from the device wafer with a force sufficient for separating the carrier wafer from the cap structure while the cap structure remains attached to the frame structure.